Two-layered micro channel heat sink, devices and systems incorporating same

• US 6,457,515 B1
• Filed: 08/06/1999
• Issued: 10/01/2002
• Est. Priority Date: 08/06/1999
• Status: Expired due to Fees

• Current Assignee: Ohio State Innovation Foundation (Ohio State University)
• Original Assignee: Ohio State University
• Inventors: Vafai, Kambiz, Zhu, Lu
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): DUONG, THO V
• Application Number:
  US09/369,564
• Publication Number:
  US 20020079087A1
• Time in Patent Office: 1,152 Days
• Field of Search: 165/80.4, 165/168, 361/699
• US Class Current: 165/80.4
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention includes heat sinks, heat sink devices, and heat sink systems. The invention also includes machines or electronic devices using these aspects of the invention. The present invention also includes in broadest terms, an electronic device in thermal contact with a two-layered micro-channeled heat sink device.

Claims

1. A two-layer micro-channel heat sink for use with a heat generating surface comprising:

a first layer comprising an input, an output, and at least one micro-channel disposed between said input of said first layer and said output of said first layer, each said at least one microchannel of said first layer for transporting a first flow of coolant from said input of said first layer to said output of said first layer, said first layer in thermal contact with said heat-generating surface;

a second layer comprising an input, an output, and at least one micro-channel disposed between said input of said second layer and said output of said second layer, each said at least one micro-channel of said second layer for transporting a second flow of coolant from said input of said second layer to said output of said second layer, said second layer adjacent to and in thermal contact with said first layer, wherein said second flow of coolant flows in a direction opposite said first flow of coolant;

a flow splitting junction, said flow splitting junction adapted to receive a common flow of coolant and to split said common flow of coolant into a first flow and a second flow, said flow splitting junction in fluid communication with said input of said first layer and said input of said second layer;

a flow combining junction, said flow combining junction in fluid communication with said output of said first layer and said output of said second layer, said flow combining junction adapted to receive said first flow of coolant and said second flow of coolant and to combine said first and second flow of coolant into a common flow of coolant; and

a device for supplying said flow splitting junction with said common flow of coolant and for receiving said common flow of coolant from said flow combining junction so as to circulate coolant across said first layer and said second layer.

2. A two-layered micro-channel heat sink according to claim 1 further comprising a cooling device attached to said coolant circulating device whereby excess heat is removed from said coolant.

3. A two-layered micro-channel heat sink according to claim 1 further comprising a heat exchanging device attached to said coolant circulating device whereby excess heat is removed from said coolant.

4. A two-layered micro-channel heat sink according to claim 1 further comprising a coolant filter attached to said coolant circulating device whereby impurities may be removed from said coolant.

5. A two-layered micro-channel heat sink according to claim 1 further comprising a coolant reservoir attached to said coolant circulating device whereby coolant can be stored for later use in said heat sink.

6. A two-layered micro-channel heat sink according to claim 1 wherein said heat sink comprises a heat-conducting material selected from the group consisting of silicon.

7. A two-layered micro-channel heat sink according to claim 1 wherein said micro-channels individually comprise dimensions less than one-sixteenth of an inch in width and height and proportional to said heat generating surface in length.

8. An electronic device, said device in thermal contact with a two-layered micro-channeled heat sink device, said device comprising:

electronic circuitry capable of generating heat;

a first layer comprising an input, an output, and at least one micro-channel disposed between said input of said first layer and said output of said first layer, each said at least one micro-channel for transporting a first flow of coolant from said input of said first layer to said output of said first layer, said first layer in thennal contact with said electronic circuitry;

a second layer comprising an input, an output, and at least one micro-channel disposed between said input of said second layer and said output of said second layer, each said at least one micro-channel of said second layer for transporting a second flow of coolant from said input of said second layer to said output of said second layer, said second layer adjacent to and in thermal contact with said first layer, wherein said second flow of coolant flows in a direction opposite said first flow of coolant;

a flow splitting junction, said flow splitting junction adapted to receive a common flow of coolant and to split said common flow of coolant into a first flow and a second flow, said flow splitting junction in fluid communication with said input of said first layer and said input of said second layer;

a flow combining junction, said flow combining junction in fluid communication with said output of said first layer and said output of said second layer, said flow combining junction adapted to receive said first flow of coolant and said second flow of coolant and to combine said first and second flow of coolant into a common flow of coolant; and

a device for supplying said flow splitting junction with said common flow of coolant and for receiving said common flow of coolant from said flow combining junction so as to circulate coolant across said first layer and said second layer.

9. A two-layered micro-channel heat sink according to claim 8 further comprising a cooling device attached to said coolant circulating device whereby excess heat is removed from said coolant.

10. A two-layered micro-channel heat sink according to claim 8 further comprising a heat exchanging device attached to said coolant circulating device whereby excess heat is removed from said coolant.

11. A two-layered micro-channel heat sink according to claim 8 further comprising a coolant filter attached to said coolant circulating device whereby impurities may be removed from said coolant.

12. A two-layered micro-channel heat sink according to claim 8 further comprising a coolant reservoir attached to said coolant circulating device whereby coolant can be stored for later use in said heat sink.

13. A two-layered micro-channel heat sink according to claim 8 wherein said heat sink comprises a heat-conducting material selected from the group consisting of silicon.

14. A two-layered micro-channel heat sink according to claim 8 wherein said micro-channels individually comprise dimensions less than one-sixteenth of an inch in width and height and proportional to electronic circuitry in length.