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Cantilevered multilevel LIGA devices and methods

  • US 6,458,263 B1
  • Filed: 09/29/2000
  • Issued: 10/01/2002
  • Est. Priority Date: 09/29/2000
  • Status: Active Grant
First Claim
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1. A method of forming a multi-layered LIGA microstructure on a plating base comprising the steps of:

  • (a) providing a first level microstructure having raised conductive portions;

    (b) covering and surrounding the first level microstructure with a conductive polymer layer;

    (c) machining the conductive polymer layer to a desired level so as to reveal the surface of the first level microstructure;

    (d) coating the conductive polymer layer and the surface of the first level microstructure with a metal sealing layer;

    (e) depositing a second polymer layer onto the metal sealing layer;

    (f) exposing portions of the second polymer layer to a radiation source to provide a pattern of dissolvable portions in the second polymer layer;

    (g) removing the dissolvable portions in the second polymer layer to provide accessible underlying areas of the metal sealing layer;

    (h) removing the accessible underlying areas of the metal sealing layer to provide accessible underlying areas of the first microstructure and the conductive polymer layer;

    (i) electroplating a second layer of metal onto the accessible underlying areas of the first microstructure and the conductive polymer layer;

    (j) machining the electroplated metal to provide a substantially planar surface;

    (k) removing the remainder of the second polymer layer; and

    (l) removing the metal sealing layer and the conductive polymeric layer to provide a multi-layered microstructure.

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