Optoelectronic semiconductor component

• US 6,459,130 B1
• Filed: 11/18/1999
• Issued: 10/01/2002
• Est. Priority Date: 09/29/1995
• Status: Expired due to Term

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: Siemens AG
• Inventors: Brunner, Herbert, Schellhorn, Franz, Waitl, Günter, Arndt, Karlheinz
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US09/043,840
• Time in Patent Office: 1,048 Days
• Field of Search: 237/787, 237/79, 237/87, 237/99, 237/106, 237/438, 237/436, 237/433, 237/428, 237/434, 237/435, 237/437
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Claims

1. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a lead frame having a chip carrier part;

a trough formed in the chip carrier part having a reflective inner surface;

a semiconductor chip secured in the trough of the chip carrier part wherein radiation which is at least one of emitted and received by the semiconductor chip is reflected by the reflective inner surface of the trough;

an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part;

at least two first external connections projecting from the encapsulation, said at least two first external connections being directly connected to the chip carrier part;

a connection part on the lead frame positioned at a distance from the chip carrier part; and

at least two second external connections projecting from the encapsulation, said at least two second external connections being directly connected to the connection part, said at least two second external connections not being connected to the chip carrier part.

2. A semiconductor component as claimed in claim 1, wherein the at least two first external connections are broader than the at least two second external connections.

3. A semiconductor component as claimed in claim 1, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the trough.

4. A semiconductor component as claimed in claim 1, wherein the encapsulation is formed completely of a radiation-permeable material.

5. A semiconductor component as claimed in claim 1, wherein the encapsulation further comprises:

a radiation-impermeable base body;

a recess formed in the base body; and

a radiation-permeable window positioned over the recess wherein the trough of the chip carrier part is positioned within the recess.

6. A semiconductor component as claimed in claim 5, wherein an upper edge of the trough is positioned below an upper edge of the recess so as to expose an uncovered reflective inner surface of the recess which reflects radiation emitted by the semiconductor chip.

7. A semiconductor component as claimed in claim 5, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the recess.

10. A semiconductor component as claimed in claim 7, further comprising:

at least two further external connections projecting from the encapsulation, said at least two further external connections being directly connected to the chip carrier part, wherein the at least two further external connections are broader than the at least two external connections.

8. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a lead frame having a chip carrier part;

a trough body formed in the chip carrier part having a trough with a reflective inner surface;

a semiconductor chip secured in the trough of the chip carrier part wherein radiation which is at least one of emitted and received by the semiconductor chip is reflected by the reflective inner surface of the trough; and

an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part wherein a portion of the trough body projects from the encapsulation, said portion of the trough body being utilized for at least one of an electrical connection and a thermal connection.

9. A semiconductor component as claimed in claim 8, further comprising:

a connection part on the lead frame positioned at a distance from the chip carrier part; and

at least two external connections projecting from the encapsulation, said at least two external connections being directly connected to the connection part, said at least two external connections not being connected to the chip carrier part.

11. A semiconductor component as claimed in claim 8, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the trough.

12. A semiconductor component as claimed in claim 8, wherein the encapsulation is formed completely of a radiation-permeable material.

13. A semiconductor component as claimed in claim 8, wherein the encapsulation further comprises:

a radiation-impermeable base body;

a recess formed in the base body; and

a radiation-permeable window positioned over the recess wherein the trough of the chip carrier part is positioned within the recess.

14. A semiconductor component as claimed in claim 13, wherein an upper edge of the trough is positioned below an upper edge of the recess so as to expose an uncovered reflective inner surface of the recess which reflects radiation emitted by the semiconductor chip.

15. A semiconductor component as claimed in claim 13, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the recess.

16. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a semiconductor chip which performs at least one of a radiation-emitting function and a radiation-receiving function;

a lead frame;

a chip carrier part;

a connection part positioned at a distance from the chip carrier part;

a trough body formed in the chip carrier part having a trough with a reflective inner surface; and

an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part wherein a portion of the trough body projects from the encapsulation;

said semiconductor chip being secured in said trough and electrically connected to said connection part; and

said portion of the trough body being utilized for at least one of an electrical connection and a thermal connection.

17. A semiconductor component as claimed in claim 16, further comprising:

at least two external connections projecting from the encapsulation, said at least two external connections being directly connected to the connection part, said at least two external connections not being connected to the chip carrier part.

18. A semiconductor component as claimed in claim 17, further comprising:

at least two further external connections projecting from the encapsulation, said at least two further external connections being directly connected to the chip carrier part, wherein the at least two further external connections are broader than the at least two external connections.

19. A semiconductor component as claimed in claim 16, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the trough.

20. A semiconductor component as claimed in claim 16, wherein the encapsulation is formed completely of a radiation-permeable material.

21. A semiconductor component as claimed in claim 16, wherein the encapsulation further comprises:

a radiation-impermeable base body;

a recess formed in the base body; and

a radiation-permeable window positioned over the recess wherein the trough of the chip carrier part is positioned within the recess.

22. A semiconductor component as claimed in claim 21, wherein an upper edge of the trough is positioned below an upper edge of the recess so as to expose an uncovered reflective inner surface of the recess which reflects radiation emitted by the semiconductor chip.

23. A semiconductor component as claimed in claim 21, further comprising:

a reflection-enhancing material coated over at least a portion of the reflective inner surface of the recess.