Single board power supply with thermal conductors

• US 6,459,586 B1
• Filed: 08/15/2000
• Issued: 10/01/2002
• Est. Priority Date: 08/15/2000
• Status: Expired due to Fees

• Current Assignee: Galaxy Power Incorporated
• Original Assignee: Galaxy Power Incorporated
• Inventors: Miller, Gerald, Ng, William, Schroter, Bernhard
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/638,599
• Time in Patent Office: 777 Days
• Field of Search: 361/690, 361/703-705, 361/709-713, 361/717-719, 361/740, 361/750, 361/752, 361/758, 174/16.3, 174/252, 165/80.3, 165/185, 363/141, 336/200, 336/232, 336/90, 336/61
• US Class Current: 361/719
• CPC Class Codes: H01F 17/043 with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power supply module for a computer is provided. The module includes a multilayer pc board, heat generating electrical components disposed on the board, logic elements disposed on the board and a heat sink. The module also includes thermal conducting structure disposed coupled to the pc board and thermally coupled to the heat sink and to the heat generating electrical components for transferring heat from the heat generating electrical components to the heat sink.

Claims

1. A power supply module for a computer comprising;

a generally planar pc board having a first side and a second side;

heat generating electrical components disposed on the first side of the board;

a magnetic induction device having a fist side and a second side, the first side of the magnetic induction device attached to the second side of the board;

a plurality or thermal vias through the board arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and

a heat sink thermally connected to the second side of the magnetic induction device,

wherein heat flows substantially perpendicular to the plane of the board from the heat generating electrical components on the first side of the board, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink.

2. The module of claim 1, wherein solder is disposed through the thermal vias.

3. The module of claim 1, wherein the pc board includes a set of spaced apart electrical and thermal conducting layers generally parallel to the plane of the board and perpendicular to the vias, the set electrically and thermally coupled to the vias and the heat generating electrical components, whereby heat generated by the heat generating electrical components is transferred laterally along the plane of the board to one or more of the vias.

4. The module of claim 3, wherein the thermally conducting layers are formed of copper having a basis weight of 2 ounces per square foot.

5. The module of claim 1, wherein the magnetic induction device includes a housing made of thermally conductive material.

6. The module of claim 1, wherein the magnetic induction device is a transformer.

7. The module of claim 1, wherein the magnetic induction device is an inductor.

8. The module of claim 1, wherein the heat sink and the second side of the pc board form a gap and the magnetic induction device is shaped and dimensioned to substantially bridge the gap.

9. The module of claim 8, wherein the heat sink includes a substantially planar base surface substantially parallel to the second side of the pc board to define the gap therebetween.

10. The module of claim 1, wherein the module is shaped and designed to handle input power of at least about 150 watts and output power of at least about 120 watts.

11. The module of claim 1, further comprising a single turn coil in the magnetic induction device, the coil thermally attached to the second side of the board and to the heat sink.

12. A power supply module for a computer comprising:

a generally planar pc board having first and second sides and an electrical circuit;

heat generating electrical components disposed on the first side of the board;

a magnetic induction device having a first side and a second side, the first side of the magnetic induction device attached to the second side of the board;

a plurality of thermal vias through the board, arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and

a heat sink thermally connected to the second side of the magnetic induction device,

wherein heat flows substantially perpendicular to the plane of the board from the heat generating electrical components on the fire side of the board, through the electrical circuit to the thermal vias, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink.

13. The module of claim 12, wherein solder is disposed through the thermal vias.

14. The module of claim 12, wherein the pc board includes a set of spaced apart electrical and thermal conducting layers generally parallel to the plane of the board and perpendicular to the vias, the set electrically and thermally coupled to the vias and the heat generating electrical components, whereby heat generated by the heat generating electrical components is transferred laterally along the plane of the board to one or more of the vias.

15. The module of claim 12, wherein the magnetic induction device includes a housing made of thermally conductive material.

17. The module of claim 12, wherein the heat sink and the second side of the pc board form a gap and the magnetic induction device is shaped and dimensioned to substantially bridge the gap.

18. The module of claim 12, further comprising a single turn coil in the magnetic induction device, the coil thermally attached to the second side of the board and to the heat sink.

16. The module of 12, wherein the magnetic induction device is a transformer or an inductor.

19. A power supply module for a computer comprising:

a multilayer pc board having first and second sides;

heat generating electrical components disposed on the first side of the board;

a magnetic induction device having a first side and a second side, the first side of the magnetic induction device attached to the second side of the board;

a plurality of thermal vias through the board, arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and

a heat sink thermally connected to tile second side of the magnetic induction device,

wherein heat flows from the heat generating electrical components on the first side of the board, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink and to the air.

20. The module of claim 19, wherein the pc board includes a plurality of generally parallel thermal and electrical conducting layers thermally and electrically connected to the vias.

21. The module of claim 19, further comprising a single turn coil in the magnetic induction device, the coil thermally attached to the second side of the board and to the heat sink.