Single board power supply with thermal conductors
First Claim
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1. A power supply module for a computer comprising;
- a generally planar pc board having a first side and a second side;
heat generating electrical components disposed on the first side of the board;
a magnetic induction device having a fist side and a second side, the first side of the magnetic induction device attached to the second side of the board;
a plurality or thermal vias through the board arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and
a heat sink thermally connected to the second side of the magnetic induction device, wherein heat flows substantially perpendicular to the plane of the board from the heat generating electrical components on the first side of the board, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink.
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Abstract
A power supply module for a computer is provided. The module includes a multilayer pc board, heat generating electrical components disposed on the board, logic elements disposed on the board and a heat sink. The module also includes thermal conducting structure disposed coupled to the pc board and thermally coupled to the heat sink and to the heat generating electrical components for transferring heat from the heat generating electrical components to the heat sink.
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Citations
21 Claims
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1. A power supply module for a computer comprising;
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a generally planar pc board having a first side and a second side;
heat generating electrical components disposed on the first side of the board;
a magnetic induction device having a fist side and a second side, the first side of the magnetic induction device attached to the second side of the board;
a plurality or thermal vias through the board arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and
a heat sink thermally connected to the second side of the magnetic induction device, wherein heat flows substantially perpendicular to the plane of the board from the heat generating electrical components on the first side of the board, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A power supply module for a computer comprising:
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a generally planar pc board having first and second sides and an electrical circuit;
heat generating electrical components disposed on the first side of the board;
a magnetic induction device having a first side and a second side, the first side of the magnetic induction device attached to the second side of the board;
a plurality of thermal vias through the board, arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and
a heat sink thermally connected to the second side of the magnetic induction device, wherein heat flows substantially perpendicular to the plane of the board from the heat generating electrical components on the fire side of the board, through the electrical circuit to the thermal vias, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink. - View Dependent Claims (13, 14, 15, 17, 18)
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16. The module of 12, wherein the magnetic induction device is a transformer or an inductor.
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19. A power supply module for a computer comprising:
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a multilayer pc board having first and second sides;
heat generating electrical components disposed on the first side of the board;
a magnetic induction device having a first side and a second side, the first side of the magnetic induction device attached to the second side of the board;
a plurality of thermal vias through the board, arranged substantially perpendicular to the plane of the board, the vias thermally couple the heat generating electrical components to the first side of the magnetic induction device; and
a heat sink thermally connected to tile second side of the magnetic induction device, wherein heat flows from the heat generating electrical components on the first side of the board, through the thermal vias to the second side of the board, into the first side of the magnetic induction device, and out the second side of the magnetic induction device to the heat sink and to the air. - View Dependent Claims (20, 21)
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Specification