Noncontact IC card and fabrication method thereof

• US 6,459,588 B1
• Filed: 03/07/2000
• Issued: 10/01/2002
• Est. Priority Date: 07/08/1998
• Status: Expired due to Fees

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Izumitani, Kazumi, Morizumi, Ken-ichi
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): TRAN, THANH Y
• Application Number:
  US09/508,064
• Time in Patent Office: 938 Days
• Field of Search: 361/737, 361/718, 361/764, 361/760, 361/761, 361/762, 235/492, 343/751, 343/764, 343/853, 343/895, 343/855, 343/893, 379/211.05
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4685 Manufacturing of cross-over conductors

Abstract

A noncontact IC card is provided with a card substrate 11, an IC chip 12 disposed on the card substrate 11, and a antenna circuit 13 formed on the card substrate 11 and having a pair of antenna terminals 13a and 13b, where one antenna terminal 13a is connected to the IC chip 12. An isolation layer 14 is formed over at least one portion of the antenna circuit 13, and a connection layer 15 is formed extending over the isolation layer 14. One end portion 15a of the connection layer 15 is connected to the IC chip 12 and another end portion 15b thereof is connected to the other antenna terminal 13b of the antenna circuit 13. Protective layers 16a and 16b are provided on top of the card substrate 11 to protect the IC chip 12 and the antenna circuit 13.

Claims

1. A noncontact IC card comprising:

a card substrate;

an IC chip located on one surface of said card substrate;

an antenna circuit having a pair of antenna terminals located on the same surface of said card substrate as said IC chip, where one terminal is connected to said IC chip;

an isolation layer located so as to cover a portion of said antenna circuit;

a connection layer located on said isolation layer and having a pair of end portions, one end portion being connected to said IC chip and the other end portion being connected to the other antenna terminal; and

a protective layer located on top of said card substrate, for protecting said IC chip, said antenna circuit, and said connection layer.

2. The noncontact IC card according to claim 1, wherein said antenna circuit and said connection layer are conductive ink layers;

and

said isolation layer is an insulating ink layer.

3. The noncontact IC card according to claim 1, further comprising a capacitor connected to said antenna circuit and located on the same surface of said card substrate as said antenna circuit.

4. The noncontact IC card according to claim 3, wherein said capacitor has a first electrode layer of conductive ink, a dielectric layer of insulating ink located on said first electrode layer, and a second electrode layer of conductive ink located on said dielectric layer.

5. The noncontact IC card according to claim 1, further comprising an additional antenna circuit and an additional isolation layer, said additional antenna circuit located on said antenna circuit and isolated from said antenna circuit by said additional isolation layer.

6. The noncontact IC card according to claim 1, wherein said protective layer has a first protective layer located on said one surface of said card substrate and a second protective layer located on said first protective layer.

7. The noncontact IC card according to claim 6, wherein said first protective layer includes an aperture for locating therein at least part of said IC chip.

8. The noncontact IC card according to claim 6, wherein said first protective layer is a thermo-adhesive sheet.

9. The noncontact IC card according to claim 1, further comprising pattern layers on outer sides of said card substrate and said protective layer.

10. The noncontact IC card according to claim 3, wherein said capacitor is connected to one antenna terminal of said antenna circuit and one end portion of said connection layer.

11. The noncontact IC card according to claim 10, wherein said capacitor is connected to one antenna terminal of said antenna circuit by a first linking layer and to one end portion of said connection layer by a second linking layer.

12. The noncontact IC card according to claim 4, wherein said antenna circuit and said first electrode layer of said capacitor are located on a same plane surface, said isolation layer and said dielectric layer of said capacitor are located on a same plane surface, and said connection layer and said second electrode layer of said capacitor are located on a same plane surface.

13. A method of fabricating a noncontact IC card having a card substrate with an IC chip, an antenna circuit, and a capacitor located on said card substrate, wherein said IC chip and said antenna circuit are connected by a connection layer located on an isolation layer located on said antenna circuit, said fabrication method comprising the steps of:

first conductive printing an antenna circuit and a first electrode layer onto predetermined locations of one surface of a card substrate;

insulation printing an isolation layer onto at least part of said antenna circuit formed by said first conductive printing step, and also printing a dielectric layer on said first electrode layer formed by said first conductive printing step; and

second conductive printing a connection layer on said isolation layer formed by said insulation printing step and also printing a second electrode layer on said dielectric layer formed by said insulation printing step, to form a capacitor.

14. The method of fabricating a noncontact IC card according to claim 13, further comprising a step of locating a protective layer on top of said card substrate, for protecting an IC chip, said antenna circuit, said isolation layer, and said connection layer.