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System and method for corrective action tracking in semiconductor processing

  • US 6,459,949 B1
  • Filed: 10/21/1998
  • Issued: 10/01/2002
  • Est. Priority Date: 10/21/1998
  • Status: Expired due to Term
First Claim
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1. A method for correcting out of control (OOC) semiconductor fabrication events that occur within a semiconductor processing environment, the method comprising:

  • recording said OOC events attributed to respective wafer lots fabricated by the semiconductor processing environment;

    linking a set of said OOC events to an issue record, wherein the set of said OOC events have common OOC symptoms; and

    assigning an issue owner to the issue record for correcting conditions within the semiconductor processing environment responsible for causing the set of said OOC events, wherein the issue owner is responsible for overseeing measures for said correcting conditions.

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