Method for making a high current, low profile inductor
DCFirst Claim
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1. A method for making a high current low profile inductor (IHLP) comprising:
- forming a conductive coil having an inner coil end, an outer coil end, a plurality of coil turns, and a hollow core;
attaching first and second leads to said inner and outer coil ends respectively, said first and second leads having first and second free ends respectively;
pressure molding a powdered magnetic material within said hollow core and completely around said coil so that said powdered magnetic material is substantially free from voids therein and is compressed tightly around and in contact with said conductive coil, as to create an inductor body, said free ends of said first and second leads extending outside said inductor body.
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Abstract
A method for making a high current, low profile inductor includes a wire coil having an inter coil end and an outer coil end. A magnetic material completely surrounds the wire coil to form an inductor body. First and second leads connected to the inner coil end and the outer coil end respectively extend through the magnetic material to the exterior of the inductor body. The method of operation involves pressure molding the magnetic material around the wire coil.
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Citations
5 Claims
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1. A method for making a high current low profile inductor (IHLP) comprising:
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forming a conductive coil having an inner coil end, an outer coil end, a plurality of coil turns, and a hollow core;
attaching first and second leads to said inner and outer coil ends respectively, said first and second leads having first and second free ends respectively;
pressure molding a powdered magnetic material within said hollow core and completely around said coil so that said powdered magnetic material is substantially free from voids therein and is compressed tightly around and in contact with said conductive coil, as to create an inductor body, said free ends of said first and second leads extending outside said inductor body. - View Dependent Claims (2, 3, 4, 5)
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Specification