Electronic enclosure cooling system

• US 6,462,949 B1
• Filed: 08/07/2000
• Issued: 10/08/2002
• Est. Priority Date: 08/07/2000
• Status: Expired due to Fees

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Parish, Overton L. IV, DeVilbiss, Roger S.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/633,060
• Time in Patent Office: 792 Days
• Field of Search: 361/684-691, 361/693-700, 361/709, 361/711, 257/714-716, 257/721, 257/722, 174/15.1, 174/15.2, 174/16-- 1, 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/104.33, 165/104.34, 165/122, 165/185, 454/184
• US Class Current: 361/699
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2001/0273 having special shape, e.g. curved, annular
• CPC Class Codes: H05K 7/20681 within cabinets for removing heat from sub-racks

Abstract

A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion. The cooling fluid is subsequently pumped through a liquid-to-air heat exchanger, to reject the removed heat into the atmosphere, prior to being recirculated through each of the low profile extrusions.

Claims

1. An electronic enclosure cooling system comprising:

a housing;

at least one low profile extrusion of unitary construction adapted for receiving heat from heat generating components installed within the housing, said at least one unitary low profile extrusion being formed with a unitary array of micro tubes, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship;

at least one quick connect coupling in communication with said unitary array of microtubes;

a closed fluid loop formed when said at least one unitary low profile extrusion is secured to said housing via said at least one quick connect coupling, said closed fluid loop comprised at least in part by said unitary array of microtubes, said closed fluid loop for containing a heat transfer fluid for removing heat from said heat generating components;

a heat exchanger for removing heat from a heat transfer fluid; and

means for circulating the heat transfer fluid from said heat exchanger, through said unitary array of microtubes, and back to said heat exchanger in said closed fluid loop.

2. The electronic enclosure cooling system of claim 1, wherein said heat exchanger is a liquid-to-air heat exchanger.

3. The electronic enclosure cooling system of claim 2, wherein said liquid-to-air heat exchanger further comprises a condenser coil having a plurality of cooling fins, said condenser coil being shaped to fit about a central cooling fan.

4. The electronic enclosure cooling system of claim 3, wherein said liquid-to-air heat exchanger is mounted externally on top of said housing.

5. The electronic enclosure cooling system of claim 2, wherein said liquid-to-air heat exchanger is a flat pack radiator.

6. The electronic enclosure cooling system of claim 1, further comprising a flat pack radiator disposed within said housing and connected to said closed fluid loop of said heat transfer fluid, wherein said flat pack radiator is adapted to remove heat from air within the housing.

7. The electronic enclosure cooling system of claim 1, further comprising a battery backup power system.

8. The electronic enclosure cooling system of claim 7, further comprising at least one battery cooling modular low profile unit for receiving heat from said battery backup power system, said at least one battery cooling modular low profile unit having a plurality of micro tubes connected to said closed fluid loop of said heat transfer fluid.

9. The electronic enclosure cooling system of claim 1, wherein said heat transfer fluid is a water/ethylene glycol mixture.

19. The electronic enclosure cooling system according to claim 1 wherein:

said cooling system unit comprises a heat sink; and

said heat sink is a battery tray.

10. A modular low profile unit for use in a cooling system for removing heat from at least one heat generating component, said modular low profile unit comprising:

a heat sink in contact with said at least one heat generating component;

at least one low profile extrusion of unitary construction having an exterior surface in contact with said heat sink and adapted for receiving heat from said heat sink being formed with a unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes being provided with a microtube inlet and a microtube outlet;

a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion;

a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;

at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold;

at least one fluid outlet provided on one of said first fluid manifold and said second fluid manifold; and

a quick connect coupling in communication with said at least one fluid outlet.

11. The low profile cooling system of claim 10, wherein said heat exchanger is a liquid-to-air heat exchanger.

12. The low profile cooling system of claim 11, wherein said liquid-to-air heat exchanger further comprises a condenser coil having a plurality of cooling fins, said condenser coil being shaped to fit about a central cooling fan.

13. The low profile cooling system of claim 11, wherein said liquid-to-air heat exchanger is a flat pack radiator.

14. A cooling fluid backplane comprising:

at least one low profile extrusion of unitary construction having an exterior surface adapted for receiving heat from a heat sink and being formed with a unitary array, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes having a microtube inlet and a microtube outlet;

a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion; and

a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;

at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold; and

at least one fluid outlet provides on one of said first fluid manifold and said second fluid manifold.

15. The cooling fluid backplane of claim 14, further comprising dripless quick connect fittings on said fluid inlet and said fluid outlet.

16. The cooling fluid backplane of claim 14, further comprising snap fit fasteners for attachment of said cooling fluid backplane to said heat sink.

17. A method of cooling an electronic enclosure having heat generating electronic components therein with a closed loop, liquid cooling system, said method comprising the steps of:

mounting said heat generating electronic components to a first side of at least one heat sink;

affixing said heat sink and said heat generating electronic components to a cooling fluid backplane comprised of at least one low profile extrusion being formed with a unitary array, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, wherein said heat sink and said cooling fluid backplane comprise a modular low profile unit;

placing said modular low profile unit within an enclosure adapted to receive said modular low profile unit;

conducting heat from said at least one heat sink into said cooling fluid backplane;

circulating a heat transfer fluid throughout said cooling fluid backplane;

passing said heat transfer fluid through a heat exchanger; and

recirculating the heat transfer fluid throughout the cooling fluid backplane and the heat exchanger to form a closed loop and to thereby cool said heat generating electronic components.

18. The method of claim 17, further comprising the steps of:

providing a flat pack radiator;

disposing said flat pack radiator within the enclosure to remove heat from air within the enclosure; and

circulating the heat transfer fluid throughout the flat pack radiator, the cooling fluid backplane and the heat exchanger to form a closed loop and to thereby cool said heat generating electronic components.

20. The method of claim 17, wherein:

said step of passing said heat transfer fluid through a heat exchanger comprises passing said heat transfer fluid through a flat pack radiator.