Conversion of electrical energy from one form to another, and its management through multichip module structures

• US 6,462,976 B1
• Filed: 03/02/2000
• Issued: 10/08/2002
• Est. Priority Date: 02/21/1997
• Status: Expired due to Term

• Current Assignee: University of Kansas
• Original Assignee: University of Kansas
• Inventors: Burgers, Keith C., Ang, Simon S., Olejniczak, Kraig J., Porter, Errol V
• Primary Examiner(s): Wong, Peter S.
• Assistant Examiner(s): Vu, Bao Q.
• Application Number:
  US09/517,197
• Time in Patent Office: 950 Days
• Field of Search: 363/147, 361/794, 361/761, 361/749, 361/768
• US Class Current: 363/147
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H02M 1/00 Details of apparatus for conversion
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals. In accordance with another embodiment, an integrated circuit assembly on a single substrate is capable of receiving direct current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency. In accordance with a further embodiment, an integrated circuit assembly on a single substrate is capable of receiving alternating current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency.

Claims

1. A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising:

on a single substrate a front-end rectifier;

a dynamic brake;

a link between the front-end rectifier and dynamic brake;

an inverter bridge;

a low voltage power supply;

drivers;

controller memory software;

communications subcircuits;

wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and

,

wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.

2. The power module as recited in claim 1, wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.

3. A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising:

on a flexible single substrate a front-end rectifier;

a dynamic brake;

a link between the frontend rectifier and dynamic brake;

an inverter bridge;

a low voltage power supply;

drivers;

controller memory software;

communications subcircuits;

wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and

,

wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.

4. The power module as recited in claim 3, wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.

5. A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising:

on a single flexible substrate a front-end rectifier;

a dynamic brake;

a link between the front-end rectifier and dynamic brake;

an inverter bridge;

a low voltage power supply;

drivers;

an isolation transformer;

controller memory software;

communications subcircuits;

wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and

,

wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.

6. The power module as recited in claim 5, wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.