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Automatic defect resizing tool

  • US 6,463,171 B1
  • Filed: 06/30/1999
  • Issued: 10/08/2002
  • Est. Priority Date: 06/30/1999
  • Status: Expired due to Term
First Claim
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1. A method of analyzing and classifying defects on a semiconductor wafer during a semiconductor manufacturing process, the method comprising:

  • (a) sending a production lot of wafers through a manufacturing process;

    (b) scanning a selected wafer from the production lot of wafers for defects;

    (c) sending location information for defects caught during the step of scanning to a defect management system;

    (d) sending the location information for defects to an automatic defect classification review tool; and

    (e) determining the size of each individual defect by counting the number of pixels comprising each of the individual defects and multiplying the number of pixels in each of the individual defects by the magnification factor to determine the size of each individual. defect.

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