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System for real-time control of semiconductor wafer polishing

  • US 6,464,564 B2
  • Filed: 04/18/2001
  • Issued: 10/15/2002
  • Est. Priority Date: 08/25/1993
  • Status: Expired due to Term
First Claim
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1. A method of planarizing a substrate, comprising:

  • generating friction across said substrate at least in part by biasing said substrate and a polishing surface against each other using a plurality of force-exerting applicators;

    sensing temperature at a plurality of areas of said substrate; and

    changing temperature of at least one area of said plurality of areas.

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