Electronic component and method of manufacturing

• US 6,465,320 B1
• Filed: 06/16/2000
• Issued: 10/15/2002
• Est. Priority Date: 06/16/2000
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Koury, Daniel Jr., McNeil, Andrew C., Gogoi, Bishnu P.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Le, Thao P
• Application Number:
  US09/595,090
• Time in Patent Office: 851 Days
• Field of Search: 438/17, 438/393, 438/4, 438/396, 438/14, 438/399, 438/381, 257/306
• US Class Current: 438/396
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 28/40 Capacitors

Abstract

A method of manufacturing an electronic component includes forming first, second, and third capacitors (260, 270, 280) and electrically testing the first, second, and third capacitors to characterize an etch process for a sacrificial layer. Each of the first, second, and third capacitors has different amounts of first and second electrically insulative materials.

Claims

1. A method of manufacturing an electronic component comprising:

providing a substrate;

forming a first capacitor supported by the substrate and comprised of a first electrically conductive region, a second electrically conductive region separated from the first electrically conductive region to form a first capacitive area having a size, and a first electrically insulative material located between the first and second electrically conductive regions;

forming a second capacitor supported by the substrate and comprised of a third electrically conductive region, a fourth electrically conductive region separated from the third electrically conductive region to form a second capacitive area having the size, the first electrically insulative material located between the third and fourth electrically conductive regions, and a second electrically insulative material located between the third and fourth electrically conductive regions;

forming a third capacitor supported by the substrate and comprised of a fifth electrically conductive region, a sixth electrically conductive region separated from the fifth electrically conductive region to form a third capacitive area having the size, and the second electrically insulative material located between the fifth and sixth electrically conductive regions;

electrically testing the first capacitor to measure a first capacitance value;

electrically testing the second capacitor to measure a second capacitance value; and

electrically testing the third capacitor to measure a third capacitance value.

2. The method of claim 1 wherein:

forming the first capacitor further comprises;

providing a first amount of the first electrically insulative material between the first and second electrically conductive regions;

forming the second capacitor further comprises;

providing a second amount of the first electrically insulative material between the third and fourth electrically conductive regions, wherein the second amount of the first electrically insulative material is less than the first amount of the first electrically insulative material; and

providing a third amount of the second electrically insulative material between the third and fourth electrically conductive regions; and

forming the third capacitor further comprises;

providing a fourth amount of the second electrically insulative material between the fifth and sixth electrically conductive regions, wherein the fourth amount of the second electrically insulative material is greater than the third amount of the second electrically insulative material.

3. The method of claim 1 wherein:

forming the second capacitor further comprises;

providing the first electrically insulative material located between first portions of the third and fourth electrically conductive regions; and

providing the second electrically insulative material located between second portions of the third and fourth electrically conductive regions different from the first portions of the third and fourth electrically conductive regions.

4. The method of claim 1 wherein:

forming the first capacitor further comprises;

keeping the second electrically insulative material absent from between the first and second electrically conductive regions; and

forming the third capacitor further comprises;

providing the first electrically insulative material between the fifth and sixth electrically conductive regions;

removing the first electrically insulative material from between the fifth and sixth electrically conductive regions; and

disposing the second electrically insulative material between the fifth and sixth electrically conductive regions after removing the first electrically insulative material.

5. The method of claim 1 wherein:

forming the first capacitor further comprises;

keeping the second electrically insulative material absent from between the first and second electrically conductive regions; and

forming the third capacitor further comprises;

providing the first electrically insulative material between the fifth and sixth electrically conductive regions;

removing the first electrically insulative material from between the fifth and sixth electrically conductive regions; and

disposing the second electrically insulative material between the fifth and sixth electrically conductive regions while simultaneously removing the first electrically insulative material.

6. The method of claim 1 wherein:

the first, third, and fifth electrically conductive regions are substantially identical to each other.

7. The method of claim 1 wherein:

forming the first capacitor further comprises;

providing a distance between the first and second electrically conductive regions;

forming the second capacitor further comprises;

providing the distance between the third and fourth electrically conductive regions; and

forming the third capacitor further comprises;

providing the distance between the fifth and sixth electrically conductive regions.

8. The method of claim 1 wherein:

electrically testing the second capacitor further comprises;

measuring the second capacitance value to be less than the first capacitance value; and

electrically testing the third capacitor further comprises;

measuring the third capacitance value to be less than the second capacitance value.

9. The method of claim 1 wherein:

forming the third capacitor further comprises simultaneously forming the first capacitor, the second capacitor, and the third capacitor.

10. The method of claim 1 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

simultaneously forming the first, third, and fifth electrically conductive regions;

disposing the first electrically insulative material over the first, third, and fifth electrically conductive regions;

simultaneously forming the second, fourth, and sixth electrically conductive regions over the first electrically insulative material;

removing a first portion of the first electrically insulative material from between the third and fourth electrically conductive regions;

removing a second portion of the first electrically insulative material from between the fifth and sixth electrically conductive regions;

disposing the second electrically insulative material between the third and fourth electrically conductive regions after removing the first portion of the first electrically insulative material; and

disposing the second electrically insulative material between the fifth and sixth electrically conductive regions after removing the second portion of the first electrically insulative material.

11. The method of claim 1 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

simultaneously forming the first, third, and fifth electrically conductive regions;

disposing the first electrically insulative material over the first, third, and fifth electrically conductive regions;

simultaneously forming the second, fourth, and sixth electrically conductive regions over the first electrically insulative material;

removing a first portion of the first electrically insulative material from between the third and fourth electrically conductive regions;

removing a second portion of the first electrically insulative material from between the fifth and sixth electrically conductive regions;

disposing the second electrically insulative material between the third and fourth electrically conductive regions while simultaneously removing the first portion of the first electrically insulative material; and

disposing the second electrically insulative material between the fifth and sixth electrically conductive regions while simultaneously removing the second portion of the first electrically insulative material.

12. The method of claim 11 wherein:

removing the second portion of the first electrically insulative material occurs while simultaneously removing the first portion of the first electrically insulative material; and

disposing the second electrically insulative material between the third and fourth electrically conductive regions occurs while simultaneously disposing the second electrically insulative material between the fifth and sixth electrically conductive regions.

13. The method of claim 1 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

disposing a layer over the second, fourth, and sixth electrically conductive regions to seal the second electrically insulative material between the third and fourth electrically conductive regions between the fifth and sixth electrically conductive regions.

14. The method of claim 13 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

keeping portions of the layer located over the second, fourth, and sixth electrically conductive regions continuous over the second, fourth, and sixth electrically conductive regions.

15. The method of claim 1 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

providing the first electrically insulative material consisting of a solid dielectric material; and

providing the second electrically insulative material from the group consisting of a liquid and a gas.

16. The method of claim 1 wherein:

forming the first capacitor further comprises;

keeping the first electrically insulative material between the first and second electrically conductive regions;

forming the second capacitor further comprises;

forming a first gap between the third and fourth electrically conductive regions; and

filling the first gap with the second electrically insulative material;

forming the third capacitor further comprises;

forming a second gap between the fifth and sixth electrically conductive regions; and

filling the second gap with the second electrically insulative material.

17. The method of claim 16 wherein:

forming the second gap further comprises;

forming the second gap simultaneously with the first gap; and

forming the second gap larger than the first gap.

18. A method of manufacturing an electronic component comprising:

providing a semiconductor substrate;

forming a first capacitor supported by the semiconductor substrate and comprised of a first electrically conductive region, a second electrically conductive region separated from the first electrically conductive region by a distance and overlying the first electrically conductive region to form a first capacitive area having a size, and a first amount of a first electrically insulative material located between the first and second electrically conductive regions;

forming a second capacitor supported by the semiconductor substrate and comprised of a third electrically conductive region, a fourth electrically conductive region separated from the third electrically conductive region by the distance and overlying the third electrically conductive region to form a second capacitive area having the size, a second amount of the first electrically insulative material located between the third and fourth electrically conductive regions, and a third amount of a second electrically insulative material located between the third and fourth electrically conductive regions, wherein the second amount of the first electrically insulative material is less than the first amount of the first electrically insulative material;

forming a third capacitor supported by the semiconductor substrate and comprised of a fifth electrically conductive region, a sixth electrically conductive region separated from the fifth electrically conductive region by the distance and overlying the fifth electrically conductive region to form a third capacitive area having the size, and a fourth amount of the second electrically insulative material located between the fifth and sixth electrically conductive regions, wherein the fourth amount of the second electrically insulative material is greater than the third amount of the second electrically insulative material;

forming the electronic component supported by the semiconductor substrate, the electronic component having a fourth capacitor;

electrically testing the first capacitor to measure a first capacitance value;

electrically testing the second capacitor to measure a second capacitance value less than the first capacitance value; and

electrically testing the third capacitor to measure a third capacitance value less than the second capacitance value.

19. The method of claim 18 wherein:

forming the electronic component further comprises simultaneously forming the electronic component, the first capacitor, the second capacitor, and the third capacitor.

20. The method of claim 19 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

simultaneously forming the first, third, and fifth electrically conductive regions;

disposing the first electrically insulative material over the first, third, and fifth electrically conductive regions;

simultaneously forming the second, fourth, and sixth electrically conductive regions over the first, third, and fifth electrically conductive regions, respectively, and over the first electrically insulative material;

removing a first portion of the first electrically insulative material from between the third and fourth electrically conductive regions to form a first gap between the third and fourth electrically conductive regions and to leave the second amount of the first electrically insulative material between the third and fourth electrically conductive regions;

removing a second portion of the first electrically insulative material from between the fifth and sixth electrically conductive regions to form a second gap between the fifth and sixth electrically conductive regions and to remove the first electrically insulative material from between the fifth and sixth electrically conductive regions;

disposing the third amount of the second electrically insulative material in the first gap; and

disposing the fourth amount of the second electrically insulative material in the second gap.

21. The method of claim 20 wherein:

removing the second portion of the first electrically insulative material occurs while simultaneously removing the first portion of the first electrically insulative material;

removing the second portion of the first electrically insulative material further comprises forming the second gap larger than the first gap; and

disposing the third amount of the second electrically insulative material occurs while simultaneously disposing the fourth amount of the second electrically insulative material.

22. The method of claim 21 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

disposing a third electrically insulative material over the second, fourth, and sixth electrically conductive regions to seal the third amount of the second electrically insulative material between the third and fourth electrically conductive regions and to seal the fourth amount of the second electrically insulative material between the fifth and sixth electrically conductive regions.

23. The method of claim 22 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

keeping portions of the third electrically insulative material located over the second, fourth, and sixth electrically conductive regions continuous over the second, fourth, and sixth electrically conductive regions.

24. The method of claim 23 wherein:

forming the first capacitor, forming the second capacitor, and forming the third capacitor further comprise;

providing the first electrically insulative material consisting of a solid dielectric material; and

providing the second electrically insulative material from the group consisting of a liquid and a gas.

25. A method of manufacturing an electronic component comprising:

providing a substrate;

forming a first capacitor supported by the substrate and comprised of a first electrically conductive region, a second electrically conductive region separated from the first electrically conductive region to form a first capacitive area having a size, and a first electrically insulative material located between the first and second electrically conductive regions, the first capacitor devoid of a port;

forming a second capacitor supported by the substrate and comprised of a third electrically conductive region, a fourth electrically conductive region separated from the third electrically conductive region to form a second capacitive area having the size, the first electrically insulative material located between the third and fourth electrically conductive regions, and a second electrically insulative material located between the third and fourth electrically conductive regions, the second capacitor having at least one port;

electrically testing the first capacitor to measure a first capacitance value; and

electrically testing the second capacitor to measure a second capacitance value.

26. A method of manufacturing an electronic component comprising:

providing a substrate;

forming a first capacitor supported by the substrate and comprised of a first electrically conductive region, a second electrically conductive region separated from the first electrically conductive region to form a first capacitive area having a size, a first electrically insulative material located between the first and second electrically conductive regions, and a second electrically insulative material located between the first and second electrically conductive regions, the second capacitor having a first number of ports;

forming a second capacitor supported by the substrate and comprised of a third electrically conductive region, a fourth electrically conductive region separated from the third electrically conductive region to form a second capacitive area having the size, and the second electrically insulative material located between the third and fourth electrically conductive regions, the second capacitor having a second number of ports greater than the first number of ports;

electrically testing the second capacitor to measure a second capacitance value; and

electrically testing the third capacitor to measure a third capacitance value.