Multi-strand substrate for ball-grid array assemblies and method
DC CAFCFirst Claim
1. A method for assembling ball-grid array (BGA) packages, comprising the steps of:
- providing a plurality of BGA substrates arranged in an N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, each of the plurality of BGA substrates having a plurality of bond posts on one side and a plurality of contact pads on an opposite side;
attaching a semiconductor die to each of the plurality of BGA substrates, the semiconductor die having a plurality of bond pads;
encapsulating the semiconductor die with an encapsulant;
curing the encapsulant;
attaching conductive solder balls to each of the plurality of contact pads; and
dividing the N by M array into separate BGA packages, and wherein each of the separate BGA packages is substantially planar.
19 Assignments
Litigations
1 Petition
Accused Products
Abstract
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
32 Citations
8 Claims
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1. A method for assembling ball-grid array (BGA) packages, comprising the steps of:
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providing a plurality of BGA substrates arranged in an N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, each of the plurality of BGA substrates having a plurality of bond posts on one side and a plurality of contact pads on an opposite side;
attaching a semiconductor die to each of the plurality of BGA substrates, the semiconductor die having a plurality of bond pads;
encapsulating the semiconductor die with an encapsulant;
curing the encapsulant;
attaching conductive solder balls to each of the plurality of contact pads; and
dividing the N by M array into separate BGA packages, and wherein each of the separate BGA packages is substantially planar. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
bonding conductive wires to the plurality of bond pads and the plurality of bond posts after the step of attaching the semiconductor die; and
marking the BGA packages after the step of encapsulating the semiconductor die.
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8. The method of claim 1 wherein the step of providing the plurality of BGA substrates arranged in the N by M array within the printed circuit board includes providing the plurality of BGA substrates within a printed circuit board comprises of an organic resin.
Specification