Microelectronic assemblies having solder-wettable pads and conductive elements

• US 6,465,747 B2
• Filed: 09/13/2001
• Issued: 10/15/2002
• Est. Priority Date: 03/25/1998
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Fjelstad, Joseph, DiStefano, Thomas H.
• Primary Examiner(s): PALADINI, ALBERT WILLIAM
• Application Number:
  US09/951,046
• Publication Number:
  US 20020029902A1
• Time in Patent Office: 397 Days
• Field of Search: 174/261, 174/260, 257/779, 257/692, 361/772, 361/743, 228/180.21, 228/180.22, 298/37
• US Class Current: 174/261
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01045 Rhodium [Rh]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01076 Osmium [Os]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/0969 : Apertured conductors
• CPC Class Codes: H05K 2201/0989 : Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/099 : Coating over pads, e.g. solder resist partly over pads
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2081 : Compound repelling a metal, e.g. solder
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 3/3452 : Solder masks
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the solder wettable strips being bounded by non solder-wettable material. The microelectronic assembly also includes a composite conductive element positioned atop at least one of the conductive pads, the composite conductive element including a solid conductive core and a layer of solder material overlying the solid conductive core, the solid conductive core having a higher melting temperature than the layer of solder material.

Claims

1. A microelectronic assembly comprising:

a component including one or more conductive pads, each said conductive pad including a plurality of solder-wettable strips extending outwardly away from a center, said solder wettable strips being bounded by non solder-wettable material;

a composite conductive element positioned atop at least one of said conductive pads, said composite conductive element including a solid conductive core and a layer of solder material overlying said solid conductive core, said solid conductive core having a higher melting temperature than said layer of solder material.

2. The assembly as claimed in claim 1, wherein said layer of solder material is in a molten state and said solid conductive core is in a solid state, and wherein said layer of solder material in the molten state contacts said solid conductive core and said solder-wettable strips.

3. The assembly as claimed in claim 2, wherein said layer of solder material is transformable from the molten state into a solid state, and wherein said composite conductive element is electrically interconnected with said at least one of said conductive pads.

4. The assembly as claimed in claim 1, wherein said component includes a base with said one or more conductive pads on said base, said base including a top dielectric layer and a compliant layer beneath said top dielectric layer.

5. The assembly as claimed in claim 1, wherein said at least one solid conductive core is substantially spherical.

6. The assembly as claimed in claim 1, wherein said at least one solid conductive core has a radius, and wherein the solder-wettable strips of said at least one pad project inwardly to a distance from the center of the pad that is less than the radius of the solid conductive core associated with said pad.

7. The assembly as claimed in claim 1, wherein said at least one pad includes at least three of said solder-wettable strips.

8. The assembly as claimed in claim 1, wherein said base includes a non solder-wettable dielectric material at a surface thereof that bounds said strips.

9. The assembly as claimed in claim 8, wherein said strips of said at least one pad overly said dielectric material.

10. The assembly as claimed in claim 1, wherein said at least one pad includes a metallic element having solder wettable surface regions defining the strips of the pad and non solder-wettable regions bounding said strips.

11. The assembly as claimed in claim 10, wherein said non solder-wettable regions of said at least one pad confine said layer of solder material in a molten state to said pad.

12. The assembly as claimed in claim 10, wherein said at least one pad has solder-wettable conductive traces extending therefrom along an exposed surface of the base and the non-wettable regions of said at least one pad includes non-wettable regions adjacent the intersections of said conductive traces, and wherein said non-wettable regions are adapted to block the spread of said molten layer of solder material along said traces.

13. The assembly as claimed in claim 1, wherein said component is heatable for transforming said layer of solder material from a solid state to a molten state.

14. The assembly as claimed in claim 1, wherein said solid conductive core is in contact with said conductive pad.

15. The assembly as claimed in claim 1, wherein said layer of solder material and said solid conductive core form a bump projecting from said conductive pad.

16. The assembly as claimed in claim 15, wherein said bump is insertable into a socket of a socket element.

17. The assembly as claimed in claim 1, further comprising a substrate juxtaposed with said component, said substrate having at least one pad thereon in engagement with said layer of a solder material, said layer of solder material and said solid core forming an electrical connection between said at least one pad of said component and said at least one pad on said substrate.

18. The assembly as claimed in claim 17, wherein said conductive pads on said substrate have solder thereon prior to being juxtaposed with said component.

19. The assembly as claimed in claim 4, wherein said top dielectric layer comprises a flexible polymeric sheet.

20. The assembly as claimed in claim 4, wherein the non solder-wettable material includes a dielectric solder mask layer overlying the top dielectric layer and outer ends of said solder-wettable strips.

24. The assembly as claimed in claim 20, wherein said composite conductive element is electrically interconnected with said conductive pad.

21. A microelectronic assembly comprising:

a component including one or more conductive pads on said component, each said conductive pad including a plurality of solder wettable strips extending outwardly away from a center; and

a composite conductive element atop at least one of said conductive pads, said composite conductive element including a solid conductive core and a layer of solder material overlying said solid conductive core, said solid conductive core having a higher melting temperature than said layer of solder material.

22. The assembly as claimed in claim 21, wherein the layer of solder material of said composite conductive element is heatable into a molten state for wetting to said solder wettable strips and said solid core is in a solid state.

23. The assembly as claimed in claim 22, wherein said layer of solder material is transformable from the molten state to a solid state.

25. The assembly as claimed in claim 21, wherein said base includes a top dielectric layer and a compliant layer beneath said top dielectric layer, and wherein each said pad has a surface with a solder-wettable area and a non-solder wettable area at the periphery of the wettable area.

26. The assembly as claimed in claim 21, wherein at least some of said pads have solder-wettable conductive traces extending therefrom along an exposed surface of the base and the non-wettable regions of at least some of said pads include non-wettable regions adjacent the intersections of said pads and traces, and wherein said non-wettable regions are adapted for blocking spread of the solder along said traces when said layer of solder material is in a molten state.

27. A microelectronic assembly comprising:

a component including a base and one or more pads on said base, each said pad including a plurality of solder-wettable strips extending outwardly away from a center, said solder-wettable strips being bounded by non-solder-wettable material;

providing composite conductive elements atop said one or more conductive pads, each said composite conductive element including a solid conductive core and a layer of solder material overlying said solid conductive core, said solid conductive core having a higher melting temperature than said layer of solder material, wherein said composite conductive elements are heatable to a temperature whereby the layers of solder material are in a molten state for wetting to said conductive pads while said solid cores remains in a solid state.

28. The assembly as claimed in claim 27, wherein said layers of solder material in the molten state are transformable to a solid state, and wherein said composite conductive elements are electrically interconnected with said conductive pads.

29. The assembly as claimed in claim 28, wherein said base includes a flexible polymeric sheet and a compliant layer beneath said flexible polymeric sheet.

30. The assembly as claimed in claim 29, wherein said non-solder-wettable material includes a dielectric solder mask layer over said flexible polymeric sheet, and wherein said solder mask layer has a hole at each said pad.

31. The assembly as claimed in claim 30, wherein the holes in said dielectric solder mask layer are substantially circular and substantially concentric with the centers of said pads.

32. The assembly as claimed in claim 30, wherein the holes in said dielectric solder mask layer are sized so that the outer ends of said solder-wettable strips are beneath said dielectric solder mask layer.