Imager structure
First Claim
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1. A structure for an imager, comprising:
- a substrate;
at least one data line disposed on said substrate;
an organic dielectric layer; and
a common electrode, said common electrode comprising a light-transmissive conductive layer covering said organic dielectric layer and extending beyond an exposed edge of said organic dielectric layer along a striped segment of said common electrode;
wherein said striped segment does not overlie said at least one data line.
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Abstract
In an imager having an array of light-sensitive elements and employing striped common electrodes, exposed edges of preimidized polyimide layers above the light-sensitive imaging elements are sealed with the material of the common electrode (e.g., indium tin oxide). Similarly, exposed preimidized polyimide edges in electrical contacts for the array and bridge members electrically coupling adjacent light-sensitive imaging elements are also sealed with the material of the common electrode.
79 Citations
19 Claims
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1. A structure for an imager, comprising:
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a substrate;
at least one data line disposed on said substrate;
an organic dielectric layer; and
a common electrode, said common electrode comprising a light-transmissive conductive layer covering said organic dielectric layer and extending beyond an exposed edge of said organic dielectric layer along a striped segment of said common electrode;
wherein said striped segment does not overlie said at least one data line. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An imager comprising:
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a substrate;
a plurality of data lines disposed on said substrate;
at least one electrical contact within said imager, said at least one electrical contact comprising a first layer of conductive material and a common electrode, said common electrode comprising a second layer of light-transmissive conductive material;
an organic dielectric layer situated between portions of said first layer of conductive material and said second layer of light-transmissive conductive material;
an organic dielectric layer situated between portions of said first layer of conductive material and second layer of light-transmissive conductive material; and
a via region to provide electrical contact between said first layer of conductive material such that said second layer of light-transmissive conductive material is disposed in electrical contact with said first layer of conductive material, said organic dielectric being removed from at least one portion of said imager on a side of said via region;
said common electrode comprising a plurality of striped segments, wherein said plurality of striped segments do not overlie said plurality of data lines;
said second layer of light-transmissive conductive material being disposed to extend at least about one micron beyond an exposed edge of said organic dielectric layer in said via region and along said striped segments of said common electrode. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification