Component transformer

• US 6,466,454 B1
• Filed: 05/18/1999
• Issued: 10/15/2002
• Est. Priority Date: 05/18/1999
• Status: Expired due to Term

• Current Assignee: DET International Holding Limited (Delta Electronics Incorporated)
• Original Assignee: Ascom Energy Systems AG (Delta Electronics Incorporated)
• Inventors: Jitaru, Ionel
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/313,939
• Time in Patent Office: 1,246 Days
• Field of Search: 361/719, 361/720, 361/748, 361/760, 361/761, 361/762, 361/764, 361/767, 361/768, 361/780, 361/781, 361/782, 361/783, 361/792, 361/793-796, 361/802-804, 361/807-811, 361/818, 361/820, 361/821, 361/836, 336/200, 336/205, 336/232, 333/12, 333/185, 333/246, 333/247
• US Class Current: 361/836
• CPC Class Codes: H01F 27/06 Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product

Abstract

A new packaging technology which improves the electrical and mechanical performance of the circuits using magnetic elements. High frequency current loops generate electromagnetic fields which are radiated or induce high frequency current in the rest of the circuit. To reduce the radiated field, these loops have been minimized by locating the high frequency switching components close to each other and very close to the magnetic elements. By separating the high frequency switching electronic components from the rest of the electronic components and locating them on the same multilayer PCB where the magnetic element is constructed, optimal results are obtained.

Claims

1. An electronic assembly comprising:

a) an electronic board having an opening therein, said electronic board further including at least two pads positioned on a first surface of said electronic board proximate to said opening;

b) a multilayer circuit board having secured thereto a transformer, said multilayer circuit board positioned such that a portion of a first surface of said multilayer circuit board engages the first surface of said electronic board such that a portion of a core of said transformer extends into said opening, said multilayer circuit board having at least two channels therethrough, each of said channels aligned with one of said at least two pads;

c) solder extending through said at least two channels in said multilayer circuit board, said solder bonded to said channels and associated pads on said electronic board; and

d) at least one electronic component secured to an opposing second surface of said multilayer circuit board.

2. The electronic assembly according to claim 1, further including at least one electronic component secured to the first surface of said multilayer circuit board and enclosed within said opening in said electronic board.

3. The electronic assembly according to claim 2, wherein, during operation of said electronic assembly, electrical current passes through said solder extending through said at least two channels in said multilayer circuit board.

4. The electronic assembly according to claim 3,

a) wherein said multilayer circuit board includes at least two aligning pins; and,

b) wherein said electronic board includes at least two alignment holes adapted to receive said at least two aligning pins of said multilayer circuit board.

5. The electronic assembly according to claim 4, wherein said at least two aligning pins are not bonded with the at least two alignment holes of said electronic board.

6. An electronic assembly comprising:

a) an electronic board having an opening therein, said electronic board further including at least two pads positioned on a first surface of said electronic board proximate to said opening;

b) a multilayer circuit board having secured thereto a transformer, said multilayer circuit board positioned such that a portion of a first surface of said multilayer circuit board engages the first surface of said electronic board such that a portion of a core of said transformer extends into said opening, said multilayer circuit board having at least two channels therethrough, each of said channels aligned with one of said at least two pads;

c) solder extending through said at least two channels in said multilayer circuit board, said solder bonded to said channels and associated pads on said electronic board; and

d) high frequency switching electronic components located on said multilayer circuit board, said high frequency switching electronic components feeding primary and secondary high frequency loops of said transformer.

7. A transformer assembly comprising:

a) a multilayer circuit board having at least two channels therethrough;

b) a transformer formed in said multilayer circuit board, a portion of a core of said transformer extending therethrough;

c) an electronic board having an opening therein, said electronic board further including at least two pads positioned on a first surface thereof proximate said opening, wherein a portion of a first surface of said multilayer circuit board is adapted to engage the first surface of said electronic board such that a portion of said core of said transformer extends into said opening, wherein each of said channels is adapted to be aligned with respective pads of said electronic board, and wherein said multilayer circuit board is adapted to be secured to said electronic board using solder extending through each of said channels and bonded to said pads; and

d) at least one electronic component secured to a second surface of said multilayer circuit board.

8. The transformer assembly according to claim 7, wherein said portion of said first surface of said multilayer circuit board engages the first surface of said electronic board, the assembly further including at least one electronic component secured to the first surface of said multilayer circuit board and enclosed within said opening in said electronic board.

9. The transformer assembly according to claim 8, wherein, during operation of said transformer, electrical current passes through solder in said channels.

10. The transformer assembly according to claim 9, wherein said multilayer circuit board includes at least two aligning pins adapted to engage alignment holes in said electronic board.

11. A transformer assembly comprising:

a) a multilayer circuit board having at least two channels therethrough;

b) a transformer formed in said multilayer circuit board, a portion of a core of said transformer extending therethrough;

c) an electronic board having an opening therein, said electronic board further including at least two pads positioned on a first surface thereof proximate said opening, wherein a portion of a first surface of said multilayer circuit board is adapted to engage the first surface of said electronic board such that a portion of said core of said transformer extends into said opening, wherein each of said channels is adapted to be aligned with respective pads of said electronic board, and wherein said multilayer circuit board is adapted to be secured to said electronic board using solder extending through each of said channels and bonded to said pads; and

d) one or more high frequency switching electronic components located on said multilayer circuit board, said high frequency switching electronic components feeding primary and secondary high frequency loops of said transformer.

12. An electronic assembly comprising:

a) an electronic board having an opening therein, said electronic board further including at least two pads positioned on a first surface of said electronic board proximate to said opening, said electronic board further having at least two electronic elements thereon;

b) a multilayer circuit board having,

1) a transformer, a core of said transformer extending through said multilayer circuit board,

2) a first surface engaging the first surface of said electronic board such that a portion of said core of said transformer extends into the opening of said electronic board,

3) at least two channels extending through said multilayer circuit board, each of said channels aligned with one of said at least two pads of said electronic board, and

4) at least one electronic component secured to a second surface of said multilayer circuit board;

c) solder extending through said at least two channels in said multilayer circuit board, said solder bonded to the channel and to an associated pad on said electronic board; and

d) wherein said transformer electrically communicates with said at least two electronic elements of said electronic board via solder in said at least two channels.

13. The electronic assembly according to claim 12,

a) further including at least one electronic component secured to the first surface of said multilayer circuit board and enclosed within said opening in said electronic board; and,

b) wherein said at least one electronic component secured to the first surface of said multilayer circuit board electrically communicates with said at least two electronic elements of said electronic board via said solder in said at least two channels.

14. The electronic assembly according to claim 12, further including magnetic loop components located on said multilayer circuit board, said magnetic loop components feeding primary and secondary high frequency loops of said transformer.