Optical module and manufacturing method thereof

• US 6,466,708 B2
• Filed: 12/26/2000
• Issued: 10/15/2002
• Est. Priority Date: 12/28/1999
• Status: Expired due to Fees

• Current Assignee: Minolta Corporation Limited (Konica Minolta Inc.)
• Original Assignee: Minolta Corporation Limited (Konica Minolta Inc.)
• Inventors: Sekine, Koujirou, Teramoto, Miyuki, Takada, Kyu, Yokoyama, Mitsuru, Hatano, Takuji
• Primary Examiner(s): Patel, Tulsidas
• Assistant Examiner(s): Prasad, Chandrika
• Application Number:
  US09/745,463
• Publication Number:
  US 20010006567A1
• Time in Patent Office: 658 Days
• Field of Search: 385/14, 385/125, 385/130, 385/132, 385/37, 385/131
• US Class Current: 385/14
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 2006/12176 Etching
• CPC Class Codes: G02B 6/12007 forming wavelength selective elements, e.g. multiplexer, demultiplexer
• CPC Class Codes: G02B 6/1225 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method

Abstract

An optical module has a substrate, a waveguide, formed on the substrate, for guiding light, and a photonic crystal portion that has media having different refractive indices arranged in a periodic pattern and that is disposed in a channel of the waveguide on the substrate. Here, the photonic crystal and the substrate are integrally formed. The formation comprises the steps of forming an aluminum film on the top of a conductive substrate, forming a protective film on the aluminum film, removing the protective film from a predetermined area to form a window over the predetermined area, anodizing the aluminum film exposed through the window to form photonic crystals, removing the protective film, cladding the bottom of the substrate and forming a core layer over the cladded bottom.

Claims

1. A method for manufacturing an optical module, comprising:

an aluminum film formation step for forming an aluminum film on a conductive substrate;

a protective film formation step for forming a protective film on the aluminum film;

an exposure step for exposing the aluminum film by removing the protective film within a predetermined area;

an anodization step for forming a photonic crystal formed of a porous material by anodizing the aluminum film within the predetermined area;

a removal step for making the photonic crystal project by removing the protective film and the aluminum film;

a lower cladding formation step for forming a lower cladding layer on the substrate;

a core formation step for forming a core layer on the lower cladding layer;

a waveguide formation step for forming a waveguide by patterning the core layer into a predetermined shape; and

an upper cladding formation step for forming an upper cladding layer covering the waveguide.

2. A method for manufacturing an optical module as claimed in claim 1,

wherein a pit formation step for forming pits in a predetermined periodic pattern on the aluminum film is inserted before the anodization step.

3. A method for manufacturing an optical module as claimed in claim 2,

wherein the pits are formed by electron beam patterning.

4. A method for manufacturing an optical module comprising:

a protective film formation step for forming a protective film on an aluminum substrate;

an exposure step for exposing the aluminum substrate by removing the protective film within a predetermined area;

an anodization step for forming a photonic crystal formed of a porous material by anodizing the aluminum substrate within the predetermined area where the aluminum substrate is exposed by removing the protective film;

a removal step for making the photonic crystal project by removing the protective film and an upper layer of the aluminum film;

a lower cladding formation step for forming a lower cladding layer on the substrate;

a core formation step for forming a core layer on the lower cladding layer;

a waveguide formation step for forming a waveguide by patterning the core layer into a predetermined shape; and

an upper cladding formation step for forming an upper cladding layer covering the waveguide.

5. A method for manufacturing an optical module as claimed in claim 4,

wherein a pit formation step for forming pits in a predetermined periodic pattern on the aluminum substrate is inserted before the anodization step.

6. A method for manufacturing an optical module as claimed in claim 5,

wherein the pits are formed by electron beam patterning.

7. A method for manufacturing an optical module comprising:

a lower cladding formation step for forming a lower cladding layer on a conductive substrate;

a core formation step for forming a core layer on the lower cladding layer;

a waveguide formation step for forming a waveguide by patterning the core layer into a predetermined shape;

an upper cladding formation step for forming an upper cladding layer covering the waveguide;

a removal step for removing the upper cladding layer, the core layer, and the lower cladding layer within a predetermined area;

an aluminum filling step for filling the predetermined area with aluminum; and

an anodization step for forming a photonic crystal formed of a porous material by anodizing the aluminum filling in the predetermined area.

8. A method for manufacturing an optical module as claimed in claim 7,

wherein a pit formation step for forming pits in a predetermined periodic pattern on the aluminum is inserted before the anodization step.

9. A method for manufacturing an optical module as claimed in claim 8,

wherein the pits are formed by electron beam patterning.