Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same

• US 6,467,138 B1
• Filed: 05/24/2000
• Issued: 10/22/2002
• Est. Priority Date: 05/24/2000
• Status: Expired due to Term

• Current Assignee: Vermon (BNP Paribas S.A.)
• Original Assignee: Vermon (BNP Paribas S.A.)
• Inventors: Aimé, Flesch
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Kim, Paul D
• Application Number:
  US09/577,342
• Time in Patent Office: 881 Days
• Field of Search: 29/253.5, 295/94, 298/46, 298/48, 298/58, 298/30, 310/326, 310/327
• US Class Current: 29/25.35
• CPC Class Codes: G10K 11/002 Devices for damping, suppressing, obstructing or conducting sound in acoustic devices G10K1/06 - G10K1/10 take precedence; for electro-mechanical transducers for communication H04R3/002
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49172 by molding of insulating material
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material
• CPC Class Codes: Y10T 83/0457 By retaining or reinserting product in workpiece
• CPC Class Codes: Y10T 83/0538 Repetitive transverse severing from leading edge of work
• CPC Class Codes: Y10T 83/2079 Remaining or re-inserted product portion from base material

Abstract

This invention is provided a method for making a backing layer for an ultrasonic matrix array transducer useful in diagnostic imaging, non-destructive material testing and treatment of human organs. The method includes placing the grid in a mold, filling the mold with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, curing the material in the mold so as to form a block formed by the cured absorbent material and the grid, and releasing the block from the mold.

Claims

1. A method for making a stacked, multiple layer backing layer for a transducer array, said method comprising:

producing a first backing layer by steps comprising;

i) providing a conductive grid comprising a plurality of contacts each having a free end and each being joined together by a common base at an end thereof opposite to said free end so that spaces are provided between the free ends of the contacts;

(ii) placing the grid in a mold;

(iii) filling the mold with an acoustically absorbent material such that the absorbent material fills said spaces;

(iv) curing the material in the mold so as to form a block having a thickness and comprising the cured absorbent material and said grid;

(v) releasing the block from the mold; and

(vi)removing said common base of the grid in said block so as to separate the contacts from one another within said block and so that the separated contacts extend through the thickness of the block between opposite surfaces thereof, and

(vii) processing said block to produce a backing layer having a contact pattern formed by the separated contacts

producing a second backing layer having a substantially identical contact pattern to that of said first backing layer by repeating steps (i)-(vii); and

,

stacking said first and second backing layers so that the separated contacts of the first and second layers are in alignment and provide conductive paths extending through the first and second layers to thereby produce the stacked, multiple layer backing layer.

2. A method for making a backing layer for a transducer array, said method comprising:

providing a conductive grid comprising a plurality of contacts each having a free end and each being joined together by a common base at an end thereof opposite to said free end so that spaces are provided between the free ends of the contacts;

placing the grid in a mold;

filling the mold with an acoustically absorbent material such that the absorbent material fills said spaces;

curing the material in the mold so as to form a block comprising the cured absorbent material and said grid;

releasing the block from the mold; and

removing said common base of the grid in said block so as to separate the contacts from one another within said block,

said grid being formed using a master mold having shape matching that of the grid, and said method further comprising electro-depositing metal on the master mold, and removing the master mold to form the grid.

3. A method according to claim 2 wherein said master mold includes a plurality of protrusions therein of a shape, and arranged in a pattern, matching that of the contacts so that when said master mold is removed, hollow contacts are formed.

4. A method according to claim 3 wherein said hollow contacts are filled with acoustically absorbent material.

5. A method according to claim 3 wherein said hollow contacts are filed with metal.

6. A method according to claim 2 wherein said master mold includes a plurality of recesses therein of a shape, and arranged in a pattern, matching that of the contacts so that when said master mold is removed, solid contacts are formed.

7. A method according to claim 2 further comprising mounting said contacts on a curved surface of a piezoelectric member so that one end of each of said contacts engages said member, said contacts at said one end thereof defining discontinuous curve of a curvature inverse to that of the curved surface of said piezoelectric member.

8. A method according to claim 7 further comprising providing an electrical connection between opposite ends of said contacts and a flexible circuit.

9. A method according to claim 7 further comprising affixing a rigid printed circuit board to opposite ends of said contacts.