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Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same

  • US 6,467,138 B1
  • Filed: 05/24/2000
  • Issued: 10/22/2002
  • Est. Priority Date: 05/24/2000
  • Status: Expired due to Term
First Claim
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1. A method for making a stacked, multiple layer backing layer for a transducer array, said method comprising:

  • producing a first backing layer by steps comprising;

    i) providing a conductive grid comprising a plurality of contacts each having a free end and each being joined together by a common base at an end thereof opposite to said free end so that spaces are provided between the free ends of the contacts;

    (ii) placing the grid in a mold;

    (iii) filling the mold with an acoustically absorbent material such that the absorbent material fills said spaces;

    (iv) curing the material in the mold so as to form a block having a thickness and comprising the cured absorbent material and said grid;

    (v) releasing the block from the mold; and

    (vi)removing said common base of the grid in said block so as to separate the contacts from one another within said block and so that the separated contacts extend through the thickness of the block between opposite surfaces thereof, and (vii) processing said block to produce a backing layer having a contact pattern formed by the separated contacts producing a second backing layer having a substantially identical contact pattern to that of said first backing layer by repeating steps (i)-(vii); and

    , stacking said first and second backing layers so that the separated contacts of the first and second layers are in alignment and provide conductive paths extending through the first and second layers to thereby produce the stacked, multiple layer backing layer.

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