Method and apparatus for improved substrate handling

• US 6,468,353 B1
• Filed: 03/29/2000
• Issued: 10/22/2002
• Est. Priority Date: 06/04/1997
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Gantvarg, Eugene, Perlov, Ilya, Grunes, Howard E., Goder, Alexey
• Primary Examiner(s): Lund, Jeffrie R.
• Application Number:
  US09/538,013
• Time in Patent Office: 937 Days
• Field of Search: 118/719, 118/724, 204/298.35, 204/298.25, 414/217, 414/217.1, 414/221, 414/222.01, 414/222.03, 414/222.07, 414/222.12, 414/223.01, 414/331-2-3, 414/332, 414/403, 414/564, 414/749.1, 414/935, 414/937, 414/938, 414/939, 414/941
• US Class Current: 118/724
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction. The magnetic levitation is preferably achieved via four radially disposed and vertically arranged magnet pairs having distance sensors for maintaining desired spacing therebetween. In a most preferred embodiment, one substrate is heated/degassed on a first portion of a temperature adjustment plate in preparation for processing while a second substrate is processed, and a third processed substrate is cooled on a second portion of the temperature adjustment plate.

Claims

1. A transfer chamber comprising:

a first sealable slit;

a second sealable slit adapted to couple to a vacuum processing chamber;

a substrate handler adapted to transfer substrates through the second sealable slit;

a temperature adjustment mechanism adapted to adjust the temperature of a substrate contained within the transfer chamber,

wherein the temperature adjustment mechanism comprises a temperature adjustment plate adapted to support at least one substrate; and

a movable substrate carriage having one or more substrate storage members, adapted to place at least one substrate on the temperature adjustment plate.

2. The apparatus of claim 1 wherein the substrate carriage comprises a plurality of substrate storage members.

3. The apparatus of claim 1 wherein the substrate carriage is adapted to rotate and to elevate above and below a level of a top surface of the temperature adjustment plate.

4. The apparatus of claim 1 comprising a substrate handler disposed below the substrate carriage and having a blade adapted to hold a substrate.

5. The apparatus of claim 4 wherein the substrate carriage is adapted to place at least one substrate on the substrate handler blade.

6. The apparatus of claim 5 wherein the substrate handler is a linear substrate handler.

7. The apparatus of claim 6 wherein the temperature adjustment plate comprises a cavity, and wherein the linear wafer handler is at least partially disposed within the cavity.

8. The apparatus of claim 5 wherein the chamber comprises a slit located at a first level;

the top surface of the temperature adjustment plate and the blade are positioned at the first level;

the substrate carriage is adapted to rotate and to elevate above and below the first level; and

each storage member comprises a pair of opposing wafer supports having a passage therebetween which is wider than the substrate handler blade.

9. The apparatus of claim 4 wherein each substrate storage member comprises a pair of opposing wafer supports having a passage therebetween which is wider than the substrate handler blade.

10. The apparatus of claim 1 wherein the temperature adjustment plate, the substrate carriage and the substrate handler are coupled to a first wall of the chamber.

11. The apparatus of claim 1 wherein the temperature adjustment plate is adapted to support two substrates;

and

the substrate carriage is rotatable having three substrate storage locations and adapted to elevate above and below a top surface of the temperature adjustment plate; and

the substrate handler is a linear substrate handler and disposed below the substrate carriage having a substrate support adapted to support a substrate;

wherein the substrate carriage and the substrate support are adapted so that lowering of the substrate carriage transfers substrates to the temperature adjustment plate and to the substrate support, and such that the substrate support can travel through the second sealable slit while the substrate carriage is lowered.