Web process interconnect in electronic assemblies

• US 6,468,638 B2
• Filed: 03/16/1999
• Issued: 10/22/2002
• Est. Priority Date: 03/16/1999
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Jacobsen, Jeffrey Jay, Gengel, Glenn Wilhelm, Hadley, Mark A., Craig, Gordon S. W., Smith, John Stephen
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): STEIN, STEPHEN J
• Application Number:
  US09/268,755
• Publication Number:
  US 20020061392A1
• Time in Patent Office: 1,316 Days
• Field of Search: 428/620, 428/901, 428/209, 174/52.1, 174/59, 257/688, 257/690, 257/702, 257/709, 257/723, 257/724, 257/725, 257/781, 298/25, 361/728, 361/729
• US Class Current: 428/209
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/24926 : including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Claims

1. An electronic assembly comprising:

a substrate having a plurality of blocks which are deposited onto receptor regions of said substrate, each of said blocks including at least one functional component and at least one electrical terminal; and

a flexible layer attached to said substrate, said flexible layer comprising an electrical interconnect layer.

2. An electronic assembly as in claim 1 wherein said at least one functional component is an electrical component and said blocks are fabricated separately from said substrate and are deposited onto said substrate.

3. An electronic assembly as in claim 1 wherein said substrate is flexible and is attached to said flexible layer in a web process.

4. An electronic assembly as in claim 1 wherein said electrical interconnect layer is attached to said flexible layer in a web process.

5. An electronic assembly as in claim 1, wherein electrical interconnect layer is a fine interconnect.

6. An electronic assembly as in claim 1, wherein electrical interconnect layer is a gross interconnect.

7. An electronic assembly as in claim 1, wherein the electrical interconnect layer is selected from the group consisting of aluminum, copper, silver, and gold.

8. An electronic assembly comprising:

a substrate having a plurality of blocks which are deposited onto receptor regions of said substrate, each of said blocks including at least one functional component and at least one electrical terminal; and

a flexible layer attached to said substrate, said flexible layer comprising an electrical interconnect layer that includes a gross interconnect layer and a fine interconnect layer.