Method of automatically identifying and skipping defective work pieces for wire-bonding operation

• US 6,468,813 B1
• Filed: 05/01/2000
• Issued: 10/22/2002
• Est. Priority Date: 05/01/2000
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Chao, Te Tsung, Fang, Hui Chin
• Primary Examiner(s): Sherry, Michael
• Assistant Examiner(s): PERT, EVAN T
• Application Number:
  US09/561,905
• Time in Patent Office: 904 Days
• Field of Search: 438/7, 438/15, 438/121, 438/123, 438/125, 438/126, 438/16, 438/111, 438/106, 257/666, 257/668, 257/676, 361/820
• US Class Current: 438/7
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/056 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/854 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A method of automatic identifying and skipping defective work pieces mainly utilizes a reject eye formed inside the die covering area on a substrate to automatically determine whether the skipping procedure is triggered or not. The method of the present invention comprises the steps of: finding and aligning the die eye of the die as well as the lead eye of the substrate; finding the reject eye when the die eye and the lead eye is evaluated as not being present; stopping the wire bonding operation and skipping to next work piece when the reject eye is located. The method of present invention is capable of automatically determining whether the skipping procedure is triggered or not thereby reducing operating down time and increasing throughput.

Claims

1. A method of automatic identifying and skipping defective work pieces when processing normal work pieces used in a wire bonding operation, each normal work piece including a substrate having a die covering area on a surface thereof and a die disposed on the die covering area, each defective work piece including the substrate but without the die, wherein the die is provided with at least a die eye formed thereon, each substrate is provided with at least a lead eye formed outside the die covering area and at least a reject eye formed inside the die covering area, the method comprising the steps of:

(a) finding and aligning the die eye of a die and the lead eye of a substrate; and

(b) finding the reject eye of the substrate when the die eye and the lead eye are evaluated as not being present in step (a).

2. The method as claimed in claim 1, further comprising a step of stopping the wire bonding operation and skipping to another work piece when the reject eye is located in step (b).

3. The method as claimed in claim 1, further comprising a step of stopping the wire bonding operation and notifying an operator when the reject eye is evaluated as not being present in step (b).

4. The method as claimed in claim 1, further comprising the step of repeating step (a) to find and align the die eye of the die and the lead eye of the substrate when the reject eye is evaluated as not being present in step (b).

5. A substrate for use in packaging of a semiconductor die, the substrate having a die covering area on which the die is disposed, the substrate comprising at least a reject eye being formed entirely inside the die covering area and being capable of being located within the teach box size of a recognition system.

6. The substrate as claimed in claim 5, wherein the reject eye is in the shape of a cross.

7. The substrate as claimed in claim 5, wherein the substrate is one of a plurality of substrates formed in a strip configuration for use in forming a plurality of substrate-based packages.

8. The substrate as claimed in claim 5, wherein the substrate is a BGA substrate.

9. A substrate for use in packaging of a semiconductor die, the substrate comprising a metal paddle for receiving the semiconductor die and a solder mask formed over the metal paddle wherein at least a portion of the metal paddle is exposed from the solder mask to form an irregular mark, wherein the substrate has a die covering area defined inside the metal paddle and an epoxy area for receiving the semiconductor die and a solder mask formed over the metal paddle wherein at least a portion of the metal paddle is exposed from the solder mask to form an irregular mark, wherein the substrate has a die covering area defined inside the metal paddle and an epoxy area that is adapted for epoxy to dispense thereon and that is defined inside the die covering area, wherein the irregular mark is formed entirely inside the die covering area but outside the epoxy area.

10. The substrate as claimed in claim 9, wherein the irregular mark is adapted to be identified by a recognition system which gives a signal of stopping a wire bonding operation when the irregular mark is located on condition that no semiconductor die is disposed on the die covering area of the substrate.

11. The substrate as claimed in claim 9, wherein the irregular mark is in the shape of a cross.

12. The substrate as claimed in claim 9, wherein the substrate is one of a plurality of substrates formed in a strip configuration for use in forming a plurality of substrate-based packages.

13. The substrate as claimed in claim 9, wherein the substrate is a BGA substrate.