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Method to encapsulate bumped integrated circuit to create chip scale package

  • US 6,468,832 B1
  • Filed: 07/19/2000
  • Issued: 10/22/2002
  • Est. Priority Date: 07/19/2000
  • Status: Active Grant
First Claim
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1. A method for providing encapsulated bumped dice, comprising:

  • providing a plurality of singulated bumped dice wherein each bumped die has an active top side with a plurality of conductive bumps and a bottom side opposite from the top side;

    attaching the bottom sides of some of the plurality of singulated bumped dice to a die attach panel;

    encapsulating the plurality of dice attached to the die attach panel in a mold compound; and

    singulating the encapsulated dice.

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