Unmolded package for a semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a substrate;
a die coupled to the substrate, the die comprising drain, source and gate regions; and
multiple solder balls coupled to the substrate adjacent the die, the solderballs being substantially coplanar with a surface of the die upon coupling the semiconductor device to a printed circuit board and providing communication between the source region and the printed circuit board;
wherein the die is substantially free of underfilling material around its periphery.
2 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface of the serves as the drain connections while the solder balls serve as the source and gate connections.
-
Citations
6 Claims
-
1. A semiconductor device comprising:
-
a substrate;
a die coupled to the substrate, the die comprising drain, source and gate regions; and
multiple solder balls coupled to the substrate adjacent the die, the solderballs being substantially coplanar with a surface of the die upon coupling the semiconductor device to a printed circuit board and providing communication between the source region and the printed circuit board;
wherein the die is substantially free of underfilling material around its periphery. - View Dependent Claims (2, 3, 4, 5, 6)
-
Specification