×

Conductive interconnect structures and methods for forming conductive interconnect structures

  • US 6,469,394 B1
  • Filed: 01/31/2000
  • Issued: 10/22/2002
  • Est. Priority Date: 01/31/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A conductive post comprising:

  • a tapered first end portion having a first substantially planar surface and a concave surface adjacent to the first substantially planar surface;

    a second end portion including a second substantially planar surface, wherein the second substantially planar surface has a larger area than the first substantially planar surface; and

    an intermediate portion disposed between the first end portion and the second end portion, said intermediate portion comprises a horizontal cross-sectional area which increases from said second end portion in a vertical axial direction.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×