Apparatus for cooling an electronic component and electronic device comprising the apparatus

• US 6,469,894 B2
• Filed: 09/19/2001
• Issued: 10/22/2002
• Est. Priority Date: 03/08/2001
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Ubukata, Hiroshi
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/955,069
• Publication Number:
  US 20020126453A1
• Time in Patent Office: 398 Days
• Field of Search: 257/706, 257/707, 257/712-714, 257/718, 257/719, 257/726, 257/727, 174/16.3, 174/252, 454/184, 165/80.3, 165/80.4, 165/185, 165/104.22, 165/104.33, 622/592, 361/695-700, 361/703-705, 361/707-712, 361/717-719
• US Class Current: 361/700
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An apparatus for cooling an electric component is provided on an electronic component mounted on a printed circuit board. The apparatus comprises a heat radiation member having a base contacting the electronic component such that heat can be conducted, and a plurality of heat radiation fins provided and standing integrally on the side of the base which is distant from the electronic component. The electronic component and the heat radiation member are surrounded by a duct member which lets air flow through the heat radiation fins. Top ends of the plurality of heat radiation fins which are distant from the base are connected to the duct member such that heat can be conducted. The duct member and the base are connected through a heat pipe such that heat can be conducted.

Claims

1. An apparatus for cooling an electronic component mounted on a printed circuit board, comprising:

a heat radiation member having a base and a plurality of heat radiation fins provided and standing integrally on the base, the base thermally contacting the electronic component;

a duct member contacting top ends of the plurality of heat radiation fins which are distant from the base, for flowing air through the plurality of heat radiation fins; and

a heat pipe connecting the duct member and the base such that heat can be conducted.

2. The apparatus according to claim 1, wherein the base is fixed to the duct member.

3. The apparatus according to claim 2, wherein the top ends of the plurality of heat radiation fins are connected with a wall part of the duct member which extends substantially in parallel with the base.

4. The apparatus according to claim 3, wherein an end of the heat pipe is connected to the wall part.

5. The apparatus according to claim 2, wherein the base contacts the electronic component through a cool sheet.

6. The apparatus according to claim 5, wherein the duct member is installed on the printed circuit board, to press the base against the electronic component through the cool sheet.

7. The apparatus according to claim 6, wherein the duct member and the printed circuit board are connected such that a pressing force of the base against the electronic component can be adjusted.

8. An electronic device having a casing including a printed circuit board mounting an electronic component, and an apparatus for cooling the electronic component, wherein the apparatus comprises:

a heat radiation member having a base and a plurality of heat radiation fins provided and standing integrally on the base, the base thermally contacting the electronic component;

a duct member contacting top ends of the plurality of heat radiation fins which are distant from the base, for flowing air through the plurality of heat radiation fins; and

a heat pipe connecting the duct member and the base such that heat can be conducted.

9. The electronic device according to claim 8, wherein the base is fixed to the duct member.

10. The electronic device according to claim 9, wherein the top ends of the plurality of heat radiation fins are connected with a wall part of the duct member which extends substantially in parallel with the base.

11. The electronic device according to claim 10, wherein an end of the heat pipe is connected to the wall part.

12. The electronic device according to claim 9, wherein the base contacts the electronic component through a cool Sheet.

13. The electronic device according to claim 12, wherein the duct member is installed on the printed circuit board, to press the base against the electronic component through the cool sheet.

14. The electronic device according to claim 13, wherein the duct member and the printed circuit board are connected such that a pressing force of the base against the electronic component can be adjusted.

15. The electronic device according to claim 8, wherein the casing is provided with an air-intake fan for feeding air into the casing, and an exhaust port for exhausting air fed into the casing.

16. The electronic device according to claim 15, wherein the casing further has an air-intake duct which connects the air-intake fan and the duct member with each other.