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Apparatus for cooling an electronic component and electronic device comprising the apparatus

  • US 6,469,894 B2
  • Filed: 09/19/2001
  • Issued: 10/22/2002
  • Est. Priority Date: 03/08/2001
  • Status: Expired due to Fees
First Claim
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1. An apparatus for cooling an electronic component mounted on a printed circuit board, comprising:

  • a heat radiation member having a base and a plurality of heat radiation fins provided and standing integrally on the base, the base thermally contacting the electronic component;

    a duct member contacting top ends of the plurality of heat radiation fins which are distant from the base, for flowing air through the plurality of heat radiation fins; and

    a heat pipe connecting the duct member and the base such that heat can be conducted.

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