Process for manufacturing electronic circuit devices

• US 6,471,115 B1
• Filed: 06/02/2000
• Issued: 10/29/2002
• Est. Priority Date: 02/19/1990
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Nishikawa, Toru, Inoue, Kosuke, Hayashida, Tetsuya, Harada, Masahide, Sato, Ryohei, Shirai, Mitsugu, Taniguchi, Yuzo, Ijuin, Masahito
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US09/585,391
• Time in Patent Office: 879 Days
• Field of Search: 228/180.22, 228/245, 228/246, 228/203, 228/205, 228/206, 228/214
• US Class Current: 228/180.22
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/056 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/11003 for holding or transferring the bump preform
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81012 Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01054 : Xenon [Xe]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 3/3489 : Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Claims

1. A process for manufacturing an electronic circuit device by bonding a solder material at least to an electrode mounted on circuit boards or an electrode of electronic parts;

said process comprising the steps of;

removing an oxide film or an organic contaminant film existing on surfaces of said electrode and the solder material;

applying said solder material to said electrode;

applying a liquid so as to cover an area to which solder is to be bonded, comprising at least said electrode and said solder material; and

heat-melting the solder material,

wherein said liquid is a material vaporizing after the bonding between said electrode and said solder material is completed in said heat-melting step, and preventing reoxidation of a surface of the area to which solder is to be bonded; and

wherein a resist is provided at an area surrounding said electrode in advance, and is formed in a thickness which is larger than a thickness of said electrode, whereby the solder material is prevented from coming off the surface of the electrode, from the solder material applying step until the bonding is completed in the heat-melting step.

2. A process for manufacturing an electronic circuit device by bonding a solder material at least to an electrode mounted on circuit boards or an electrode of electronic parts;

said process comprising the steps of;

removing an oxide film or an organic contaminant film existing on surfaces of said electrode and the solder material;

applying a liquid so as to cover at least an area to which solder is to be applied to said electrode;

applying said solder material to said area to which solder is to be applied; and

heat-melting the solder material,

wherein said liquid is a material vaporizing after the bonding between said electrode and said solder material is completed in said heat-melting step, and preventing reoxidation of a surface of the area to which solder is to be applied; and

wherein a resist is provided at an area surrounding said electrode in advance, and is formed in a thickness which is larger than a thickness of said electrode, whereby the solder material is prevented from coming off the surface of the electrode, from the solder material applying step until the bonding is completed in the heat-melting step.

3. A process for manufacturing an electronic circuit device by bonding a solder material at least to an electrode mounted on circuit boards or an electrode of electronic parts, said process comprising the steps of:

removing an oxide film or an organic contaminant film existing on surfaces of said electrode and the solder material;

applying said solder material to said electrode; and

heat-melting the solder material,

wherein a resist is provided at an area surrounding said electrode in advance, and is formed in a thickness which is larger than a thickness of said electrode, whereby the solder material is prevented from coming off the surface of the electrode, from the solder material applying step until the bonding is completed in the heat-melting step.

4. A process for manufacturing an electronic circuit device by bonding a solder material at least to an electrode mounted on circuit boards or an electrode of electronic parts, said process comprising the steps of:

removing an oxide film or an organic contaminant film existing on surfaces of said electrode and the solder material;

applying a liquid to said electrode;

applying said solder material to said area to which solder is to be applied to said electrode; and

heat-melting the solder material,

wherein said liquid is a material vaporizing after the bonding between said electrode and said solder material is completed in said heat-melting step, being applied to every electrode, and provisionally fastening said solder material to said area to which solder is to be bonded, and

wherein a resist is provided at an area surrounding said electrode in advance, and is formed in a thickness which is larger than a thickness of said electrode, whereby the solder material is prevented from coming off the surface of the electrode, from the solder material applying step until the bonding is completed in the heat-melting step.