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Method for manufacturing an intracutaneous microneedle array

  • US 6,471,903 B2
  • Filed: 09/19/2001
  • Issued: 10/29/2002
  • Est. Priority Date: 06/09/1999
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a microneedle array, comprising:

  • (a) providing a top mold structure and bottom mold structure, said top mold structure having a bottommost substantially planar surface, said bottom mold structure having a topmost substantially planar surface, said top mold structure defining a plurality of microholes and a plurality of micropillars that are located within said microholes, said micropillars each extending a substantially equal length which causes said micropillars to extend beyond said bottommost surface, said micropillars being configured so as to prevent said bottommost surface from contacting said topmost surface when said top and bottom mold structures are closed, thereby creating a gap between the bottommost surface of said top mold structure and the topmost surface of said bottom mold structure;

    (b) heating, in a separate container, a moldable material to above its melting temperature;

    (c) injecting, when said top and bottom mold structures are closed, said moldable material into said gap between the bottom surface of said top mold structure and the top surface of said bottom mold structure;

    (d) cooling said mold and said material to a temperature below the melting temperature of said material; and

    (e) opening said top and bottom mold structures, and detaching said material from said top and bottom mold structures, thereby leaving a unitary structure of an array of hollow microneedles.

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