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Methods of semiconductor processing

  • US 6,472,240 B2
  • Filed: 04/13/2001
  • Issued: 10/29/2002
  • Est. Priority Date: 02/27/1998
  • Status: Expired due to Term
First Claim
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1. A method of semiconductor processing, comprising:

  • providing a semiconductor substrate;

    anisotropically etching a cavity in the semiconductor substrate; and

    providing a temperature sensing device within the cavity of the semiconductor substrate.

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  • 5 Assignments
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