Electromagnetic interference shield device with conductive encapsulant and dam

• US 6,472,598 B1
• Filed: 04/13/2000
• Issued: 10/29/2002
• Est. Priority Date: 08/28/1998
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): Cuneo, Kamand
• Application Number:
  US09/548,702
• Time in Patent Office: 929 Days
• Field of Search: 174/52.2, 174/52.4, 174/35.R, 174/356.C, 174/260, 361/792, 361/793, 361/794, 361/795
• US Class Current: 174/535
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10161 with a rectangular active surface
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed on the upper surface of the substrate circumscribing the perimeter of the mounting region. The electrically conductive dam structure is coupled to the common voltage plane. An electrically insulating encapsulant at least partially fills the pocket defined by the substrate and the electrically conductive dam structure. The electrically insulating encapsulant contacts the electrically conductive dam structure. An electrically conductive encapsulant overlies the electrically insulating encapsulant and is coupled to the electrically conductive dam structure.

Claims

1. A package for a device, the package comprising:

a substrate including a common voltage plane and a mounting region, the device mounted to the mounting region;

an electrically conductive dam structure disposed on a surface of the substrate, the electrically conductive dam structure electrically coupled to the common voltage plane and circumscribing a perimeter of the mounting region;

an electrically insulating encapsulant at least partially filling a pocket defined by the substrate and the electrically conductive dam structure, the electrically insulating encapsulant contacting the electrically conductive dam structure; and

an electrically conductive encapsulant overlying the electrically insulating encapsulant, the electrically conductive encapsulant coupled to the electrically conductive dam structure.

2. The package of claim 1, wherein the electrically conductive encapsulant comprises an epoxy with electrically conductive fillers.

3. The package of claim 2, wherein the electrically conductive fillers comprise 5 to 50 weight percent of the electrically conductive encapsulant.

4. The package of claim 3, wherein the electrically conductive fillers comprise approximately 25 weight percent of the electrically conductive encapsulant.

5. The package of claim 1, wherein the substrate further includes electrically conductive vias coupling the electrically conductive dam structure to the common voltage plane.

6. The package of claim 5, wherein the common voltage plane is a ground plane coupled to ground.

7. The package of claim 1, wherein the common voltage plane is a ground plane coupled to ground.

8. The package of claim 1, wherein the common voltage plane, the electrically conductive dam structure, and the electrically conductive encapsulant are electrically coupled to a common voltage.

9. The package of claim 1, wherein the common voltage plane is coupled to an electrically conductive ball in a lower surface of the substrate.

10. The package of claim 1, wherein the substrate includes a contact region coupled to an electrically conductive ball in a lower surface of the substrate, the contact region being electrically coupled to circuitry within the device.

11. The package of claim 10, wherein the contact region is directly connected to a terminal disposed within the device.

12. The package of claim 1, wherein there is no additional dam structure for containing the electrically conductive encapsulant.

13. The package of claim 1, wherein the dam structure is in contact with a perimeter of the electrically conductive encapsulant.

14. The package of claim 1 wherein said electrically conductive dam structure surrounds both said electrically insulative encapsulant and said electrically conductive encapsulant.

15. A package comprising:

a substrate having a first surface and input/output terminals;

a semiconductor die coupled to the first surface of the substrate and electrically coupled to the input/output terminals of the substrate;

an electrically conductive dam on the first surface and defining a pocket around said semiconductor die, wherein said electrically conductive dam has a height above the first surface and is electrically coupled to at least one of the input/output terminals;

an electrically insulating encapsulant disposed within the pocket and covering the semiconductor die, said electrically insulating encapsulant extending to a height above the first surface that is less than the height of the electrically conductive dam;

an electrically conductive encapsulant disposed within the pocket over the electrically insulating encapsulant and in electrical communication with the electrically conductive dam.

16. The package of claim 15, wherein the electrically insulating encapsulant extends between the die and the electrically conductive dam.

17. The package of claim 15, wherein said substrate includes a second surface opposite the first surface, the second surface including said input/output terminals, and an electrically conductive plane located between the first and second surfaces, wherein the electrically conductive dam is electrically coupled to at least one of the input/output terminals through the electrically conductive plane.

18. A package comprising:

a substrate having a first surface with electrically conductive portions;

an electrically conductive dam on the first surface and electrically coupled to some of the electrically conductive portions, said electrically conductive dam defining a pocket;

a semiconductor die electrically coupled to some of the electrically conductive portions of the substrate and disposed within the pocket;

an electrically insulating encapsulant disposed on the first surface entirely within the pocket, covering the semiconductor die, and contacting said electrically conductive dam around an entire inner perimeter of the electrically conductive dam;

an electrically conductive encapsulant disposed entirely within the pocket over the electrically insulating encapsulant, said electrically conductive encapsulant being in contact with the electrically conductive dam.

19. The package of claim 18, wherein said substrate includes a second surface opposite the first surface, the second surface including a plurality of input/output terminals, and an electrically conductive plane located between the first and second surfaces, wherein the electrically conductive dam is electrically coupled to at least one of the input/output terminals through the electrically conductive plane.