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Electromagnetic interference shield device with conductive encapsulant and dam

  • US 6,472,598 B1
  • Filed: 04/13/2000
  • Issued: 10/29/2002
  • Est. Priority Date: 08/28/1998
  • Status: Expired due to Term
First Claim
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1. A package for a device, the package comprising:

  • a substrate including a common voltage plane and a mounting region, the device mounted to the mounting region;

    an electrically conductive dam structure disposed on a surface of the substrate, the electrically conductive dam structure electrically coupled to the common voltage plane and circumscribing a perimeter of the mounting region;

    an electrically insulating encapsulant at least partially filling a pocket defined by the substrate and the electrically conductive dam structure, the electrically insulating encapsulant contacting the electrically conductive dam structure; and

    an electrically conductive encapsulant overlying the electrically insulating encapsulant, the electrically conductive encapsulant coupled to the electrically conductive dam structure.

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