Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside

• US 6,472,724 B1
• Filed: 04/17/2000
• Issued: 10/29/2002
• Est. Priority Date: 04/19/1999
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Matsuzawa, Hajime, Tamura, Koetsu
• Primary Examiner(s): Wilson, Allan R.
• Application Number:
  US09/551,172
• Time in Patent Office: 925 Days
• Field of Search: 257/659, 257/660, 257/698, 257/699
• US Class Current: 257/659
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence

Abstract

In an electronic device structure, a high dam is formed on a circuit board so as to enclose input/output terminals of an electronic component mounted on the circuit board. The input/output terminals are projected from a body of the electronic component and connected to a printed circuit formed on the circuit board. The body is covered with a metal case.

Claims

1. An electronic device unit comprising:

a circuit board having a printed circuit,

an electronic component having a body and an input/output terminal, wherein said input/output terminal projects from said body, is connected to said printed circuit, and supports said electronic component on said circuit board, and

a first electromagnetic shielding formed on said circuit board for enclosing said input/output terminal when said electronic component is mounted on said circuit board, wherein said first electromagnetic shielding is located between said circuit board and said body mounted on the circuit board.

2. An electronic device unit as claimed in claim 1, wherein said body is covered with a second electromagnetic shielding.

3. An electronic device unit as claimed in claim 1, wherein said first electromagnetic shield has a square frame shape.

4. An electronic device unit comprising:

a circuit board having a printed circuit,

an electronic component having a body and an input/output terminal, wherein said input/output terminal projects from said body, is connected to said printed circuit, and supports said electronic component on said circuit board, and

a first electromagnetic shielding formed on said circuit board for enclosing said input/output terminal when said electronic component is mounted on said circuit board, wherein said first elecromagnetic shielding is made of conductive paste.

5. An electronic device unit as claimed in claim 4, wherein said conductive paste is solder paste.

6. An electronic device unit as claimed in claim 4, wherein said first electromagnetic shielding is made by a screen printing method using said conductive paste.

7. An electronic device unit as claimed in claim 4, wherein said body is covered with a second electromagnetic shielding.