Galvano-mirror and method of making the same

• US 6,473,221 B2
• Filed: 03/12/2001
• Issued: 10/29/2002
• Est. Priority Date: 11/02/2000
• Status: Active Grant

• Current Assignee: DRNC Holdings, Inc. (InterDigital, Inc.)
• Original Assignee: Fujitsu Limited
• Inventors: Mizuno, Yoshihiro, Ueda, Satoshi, Sawaki, Ippei
• Primary Examiner(s): Ben, Loha
• Application Number:
  US09/803,014
• Publication Number:
  US 20020051281A1
• Time in Patent Office: 596 Days
• Field of Search: 359/298, 359/290, 359/291, 359/871, 359/245, 359/214, 359/224, 359/221, 359/230, 359/223, 369/118, 310/306, 310/307, 372/92
• US Class Current: 359/298
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G11B 7/08564 using galvanomirrors
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

A method of making a galvano-mirror is provided. It includes the following steps. First, a first material substrate formed with a plurality of mirror plate regions is prepared. The mirror plate regions correspond in arrangement to the mirror plate of the galvano-mirror. Then, a second material substrate formed with a plurality of driver plate regions is prepared. The driver plate regions correspond in arrangement to the driver plate of the galvano-mirror. Then, the first and the second material substrates are attached to each other so that each of the mirror plate regions faces a relevant one of the driver plate regions. Finally, the attached first and second material substrates are divided into individual gaslvano-mirrors.

Claims

1. A method of making a galvano-mirror provided with a mirror plate and at least one driver plate, the mirror plate including a pivotable member upon which reflecting means and a first electrode are provided, the driver plate including a second electrode facing the first electrode, the method comprising the steps of:

preparing a first material substrate formed with a plurality of mirror plate regions each of which corresponds in arrangement to the mirror plate;

preparing a second material substrate formed with a plurality of driver plate regions each of which corresponds in arrangement to the driver plate;

attaching the first and the second material substrates so that each of the mirror plate regions faces a relevant one of the driver plate regions; and

dividing the attached first and second material substrates into individual galvano-mirrors.

2. The method according to claim 1, wherein each of the first and the second material substrates comprises a silicon wafer.

3. The method according to claim 1, further comprising the steps of preparing a third material substrate provided with a plurality of driver plate regions, and positioning the first material substrate between the second and the third material substrates.

4. The method according to claim 1, further comprising the steps of forming ribs on at least either one of the first and the second material substrates, and fixing the first and the second material substrates to each other via the ribs.

5. The method according to claim 4, wherein the ribs are halved at the step of dividing the attached first and second material substrates.

6. The method according to claim 1, wherein each of the mirror plate regions includes a non-etched flat area in which the reflecting means is provided.

7. The method according to claim 1, wherein the dividing of the attached first and second material substrates is performed so that the mirror plate and the driver plate differ in size in each of the individual galvano-mirrors.

8. The method according to claim 1, further comprising the step of forming a terminal connected to the first electrode in each of the mirror plate regions, wherein the dividing of the attached first and second material substrates is performed so that the terminal is partially exposed from the driver plate in each of the individual galvano-mirrors.

9. The method according to claim 8, wherein a predetermined portion of each driver plate region is etched away for the partial exposure of the terminal.

10. The method according to claim 1, further comprising the step of forming a through-hole in at least either one of the first and the second material substrates for electrical connection.

11. The method according to claim 10, further comprising the steps of forming a circular projection adjacent to the through-hole in at least either one of the first and the second material substrates, and filling the through-hole with a conductive material.

12. The method according to claim 11, further comprising the step of forming ribs on at least either one of the first and the second material substrates for separating the substrate regions from each other.

13. The method according to claim 12, wherein the circular projection and the ribs are formed simultaneously by a thin layer forming technique.

14. The method according to claim 1, further comprising the step of forming a stopper to prevent the pivotable member from pivoting in each of the mirror plate regions of the first material substrate, and the step of removing the stopper in dividing the attached first and second material substrates.

15. A galvano-mirror comprising:

a mirror plate provided with a pivotable member upon which reflecting means and a first electrode are provided; and

at least one driver plate provided with a second electrode facing the first electrode;

wherein the mirror plate and the driver plate differ in length from each other.

16. A galvano-mirror comprising:

a mirror plate provided with a pivotable member upon which reflecting means and a first electrode are provided; and

a driver plate having an inner surface facing the mirror plate and an outer surface opposite to the inner surface, the inner surface being provided with a second electrode facing the first electrode, the outer surface being provided with a plurality of external connection terminals;

wherein the driver plate is formed with a plurality of through-holes for connecting each of the first and the second electrodes to a relevant one of the external connection terminals.