Thermally conductive case for electrical components and method of manufacture therefor

• US 6,473,304 B1
• Filed: 10/26/1999
• Issued: 10/29/2002
• Est. Priority Date: 12/23/1996
• Status: Expired due to Term

• Current Assignee: Lineage Power Corporation (GE Aerospace)
• Original Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Inventors: Stevens, David Leonard
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/427,538
• Time in Patent Office: 1,099 Days
• Field of Search: 363/141, 175/52.2, 165/80.3, 165/185, 361/752, 361/753, 361/704, 361/707, 361/717-719, 361/705, 361/713, 174/252
• US Class Current: 361/704
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 3/28 using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allows the power supply to be coupled to a printed wiring board.

Claims

1. A thermally conductive case for holding electrical components comprising:

a metal substrate having abase and a plurality of peripheries forming four walls, thereby defining a reservoir in the thermally conductive case;

an electrically insulating material located on a substantial portion of an inner surface of each of said base and said walls; and

electrically conductive traces formed on portions of the electrically insulating material of at least two of said inner surfaces.

2. The thermally conductive case of claim 1 wherein the walls define corners therebetween and the corners are sealed.

3. The thermally conductive case of claim 2 wherein the corners are sealed by an adhesive.

4. The thermally conductive case of claim 2 further comprising an encapsulant filling at least a portion of the reservoir.

5. The thermally conductive case of claim 1 further comprising electrical components mounted in the reservoir and in thermal communication with the thermally conductive case.

6. The thermally conductive case of claim 2 wherein the corners are sealed by welding.

7. The thermally conductive case of claim 2 wherein the corners are sealed by solder.

8. A thermally conductive case for holding electrical components comprising:

a metal substrate having a base and four walls defining a five-sided reservoir, the corners of the five-sided reservoir being sealed;

an electrically insulating middle layer located on a substantial portion of an inner surface of each of said base and said four walls; and

electrically conducive traces formed on portions of the electrically insulating middle layer of least two of said walls.

9. The thermally conductive case of claim 8 wherein the corners are sealed by an adhesive.

10. The thermally conductive case of claim 8 further comprising an encapsulant filling at least a portion of the five-sided reservoir.

11. The thermally conductive case of claim 8 further comprising electrical components mounted in the five-sided reservoir and in thermal communication with the thermally conductive case.

12. The thermally conductive case of claim 8 wherein the corners are sealed by welding.

13. The thermally conductive case of claim 8 wherein the corners are sealed by solder.