Method of manufacturing electronic component
First Claim
1. A manufacturing method for fabricating multi-layered electronic parts comprising:
- (a) preparing a roll of a polyethylene microporous sheet having a longitudinal or winding direction and a transverse direction perpendicular to the winding direction, an electrode layer forming agent formed on the surface thereof, containing approximately 45 to approximately 80 volume percent of inorganic filler, having a thickness of approximately 25 μ
m or less, tensile strengths of approximately 3 kg/mm2 or more in the winding direction and of approximately 1 kg/mm2 or more in the transverse direction, and an elongation of approximately 30% or less in the winding direction, and a solvent representing approximately 0.0 to approximately 5.5 weight percent of said polyethylene microporous sheet, said layered electronic parts formed by further comprising the following steps;
(b) unwinding said roll of the polyethylene microporous sheet, (c) cutting said polyethylene microporous sheet to a predetermined length, (d) stacking said cut polyethylene microporous sheets, (e) cutting a layered structure, and (f) preparing said polyethylene microporous sheets into a multilayer nonwoven fabric having fibril form substances 0.03 to 3 μ
m in diameter.
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Accused Products
Abstract
A manufacturing method for multi-layered electronic parts which is characterized in that from a roll of a polyethylene microporous sheet which has an electrode layer forming agent formed on its surface, contains 45 to 80 volume percent of inorganic filler, and has a thickness of 25 μm or less, tensile strengths of 3 kg/mm2 or more in the longitudinal direction and of 1 kg/mm2 or more in the transverse direction, and an elongation of 30% or less in the MD direction, layered electronic parts are formed via (a) a step of unwinding the sheet, (b) a step of cutting the sheet in a predetermined length, (c) a step of stacking the cut sheets, and (d) a step of cutting the layered structure and efficient production is made possible.
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Citations
17 Claims
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1. A manufacturing method for fabricating multi-layered electronic parts comprising:
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(a) preparing a roll of a polyethylene microporous sheet having a longitudinal or winding direction and a transverse direction perpendicular to the winding direction, an electrode layer forming agent formed on the surface thereof, containing approximately 45 to approximately 80 volume percent of inorganic filler, having a thickness of approximately 25 μ
m or less, tensile strengths of approximately 3 kg/mm2 or more in the winding direction and of approximately 1 kg/mm2 or more in the transverse direction, and an elongation of approximately 30% or less in the winding direction, and a solvent representing approximately 0.0 to approximately 5.5 weight percent of said polyethylene microporous sheet, said layered electronic parts formed by further comprising the following steps;
(b) unwinding said roll of the polyethylene microporous sheet, (c) cutting said polyethylene microporous sheet to a predetermined length, (d) stacking said cut polyethylene microporous sheets, (e) cutting a layered structure, and (f) preparing said polyethylene microporous sheets into a multilayer nonwoven fabric having fibril form substances 0.03 to 3 μ
m in diameter.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
(d′
) compressing said layered structure.
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3. A manufacturing method for multi-layered electronic parts according to claim 1, further comprising after the step (e) the steps:
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(g) debinding said layered structure of polyethylene and (h) calcinating said layered structure with an inorganic filler.
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4. A manufacturing method for multi-layered electronic parts according to claim 1, wherein said solvent has a boiling point approximately 200°
- C. or lower.
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5. A manufacturing method for multi-layered electronic parts according to claim 4, wherein said roll of polyethlylene microporous sheet has a winding density of approximately 0.2 to approximately 12 g/cm3.
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6. A manufacturing method for multi-layered electronic parts according to claim 5, further comprising after the step (d) a step:
(d′
) compressing said layered structure.
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7. A manufacturing method for multi-layered electronic parts according to claim 5, further comprising after the step (e) the steps:
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(g) debinding said layered structure of polyethylene and (h) calcinating said layered structure with an inorganic filler.
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8. A manufacturing method for multi-layered electronic parts according to claim 5, further comprising a step:
(g) debinding said layered structure under the conditions of approximately 25 to approximately 500°
C. and approximately 10 to approximately 150 hours in a nitrogen atmosphere.
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9. A manufacturing method for multi-layered electronic parts according to claim 5, wherein said electronic parts are multilayer capacitors.
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10. A manufacturing method for multi-layered electronic parts according to claim 5, wherein said polyethylene microporous sheet is subjected to heat treatment at approximately 60 to approximately 120°
- C.
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11. A manufacturing method for multi-layered electronic parts according to claim 5, wherein said electrode layer forming agent contains metallic particles, said metallic particles having a diameter of 0.03 to 3 μ
- m.
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12. A manufacturing method for multi-layered electronic parts according to claim 1, further comprising a step:
(g) debinding said layered structure under the conditions of approximately 25 to approximately 500°
C. and approximately 10 to approximately 150 hours in a nitrogen atmosphere.
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13. A manufacturing method for multi-layered electronic parts according to claim 1, wherein said roll of polyethlylene microporous sheet has a winding density of approximately 0.2 to approximately 12 g/cm3.
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14. A manufacturing method for multi-layered electronic parts according to claim 11, wherein said electronic parts are multilayer capacitors.
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15. A manufacturing method for multi-layered electronic parts according to claim 11, wherein said polyethylene microporous sheet is subjected to heat treatment at approximately 60 to approximately 120°
- C.
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16. A manufacturing method for multi-layered electronic parts according to claim 11, wherein said electrode layer forming agent contains metallic particles, said metallic particles having a diameter of 0.03 to 3 μ
- m.
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17. A manufacturing method for multi-layered electronic parts according to claim 1, wherein said solvent represents approximately 0.0 to approximately 1.0 weight percent of said polyethylene microporous sheet.
Specification