P-N homojunction-based structures utilizing HVPE growth III-V compound layers
First Claim
1. A III-V p-n homojunction device, comprising:
- a substrate;
a high temperature n-type AlGaN layer grown directly on said substrate, wherein said high temperature n-type AlGaN layer is grown at a temperature greater than 900°
C. using HVPE techniques, wherein a low temperature buffer layer is not interposed between said substrate and said high temperature n-type AlGaN layer;
an n-type GaN layer grown on said high temperature n-type AlGaN layer using HVPE techniques;
a p-type GaN layer grown on said n-type GaN layer using HVPE techniques, said p-type GaN layer forming a p-n homojunction with said n-type GaN layer; and
a p-type AlGaN layer grown on said p-type GaN layer using HVPE techniques.
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Abstract
A method for fabricating p-type, i-type, and n-type III-V compound materials using HVPE techniques is provided. If desired, these materials can be grown directly onto the surface of a substrate without the inclusion of a low temperature buffer layer. By growing multiple layers of differing conductivity, a variety of different device structures can be fabricated including simple p-n homojunction and heterojunction structures as well as more complex structures in which the p-n junction, either homojunction or heterojunction, is interposed between a pair of wide band gap material layers. The provided method can also be used to fabricate a device in which a non-continuous quantum dot layer is grown within the p-n junction. The quantum dot layer is comprised of a plurality of quantum dot regions, each of which is typically between approximately 20 and 30 Angstroms per axis. The quantum dot layer is preferably comprised of AlxByInzGa1−x−y−zN, InGaN1−a−bPaAsb, or AlxByInzGa1−x−y−zN1−a−bPaAsb.
91 Citations
14 Claims
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1. A III-V p-n homojunction device, comprising:
-
a substrate;
a high temperature n-type AlGaN layer grown directly on said substrate, wherein said high temperature n-type AlGaN layer is grown at a temperature greater than 900°
C. using HVPE techniques, wherein a low temperature buffer layer is not interposed between said substrate and said high temperature n-type AlGaN layer;
an n-type GaN layer grown on said high temperature n-type AlGaN layer using HVPE techniques;
a p-type GaN layer grown on said n-type GaN layer using HVPE techniques, said p-type GaN layer forming a p-n homojunction with said n-type GaN layer; and
a p-type AlGaN layer grown on said p-type GaN layer using HVPE techniques. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
a first contact deposited on said second p-type GaN layer; and
a second contact deposited on said substrate.
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6. The III-V p-n homojunction device of claim 5, wherein said first and second contacts are selected from the group of materials consisting of nickel, palladium, gold, platinum, gold-nickel, and palladium-platinum.
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7. The III-V p-n homojunction device of claim 4, wherein said substrate is selected from the group of materials consisting of sapphire, silicon carbide, gallium nitride, and silicon.
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8. The III-V p-n homojunction device of claim 4, wherein said p-type GaN layer, said p-type AlGaN layer, and said second p-type GaN layer each include at least one acceptor impurity metal selected from the group of metals consisting of Mg, Zn, and MgZn.
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9. The III-V p-n homojunction device of claim 8, wherein a concentration of said at least one acceptor impurity metal within each of said p-type GaN layer, said p-type AlGaN layer, and said second p-type GaN layer is in the range of 1018 to 1021 atoms cm−
- 3.
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10. The III-V p-n homojunction device of claim 8, wherein a concentration of said at least one acceptor impurity metal within each of said p-type GaN layer, said p-type AlGaN layer, and said second p-type GaN layer is in the range of 1019 to 1020 atoms cm−
- 3.
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11. The III-V p-n homojunction device of claim 8, wherein said p-type GaN layer is co-doped with O.
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12. The III-V p-n homojunction device of claim 8, wherein said p-type AlGaN layer is co-doped with O.
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13. The III-V p-n homojunction device of claim 8, wherein said second p-type GaN layer is co-doped with O.
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14. The III-V p-n homojunction device of claim 4, wherein said n-type GaN layer includes at least one donor impurity selected from the group of materials consisting of O, Si, Ge, and Sn.
Specification