Semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a substrate;
at least first, second and third metal layers formed over said substrate, said first metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of first metal layer strips extending perpendicular to said first axis; and
wherein said second metal layer comprises a multiplicity of second metal layer strips extending generally parallel to said first axis.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device comprises a substrate having at least first, second and third metal layers formed over it. The metal layers comprise parallel strips. The strips of a given metal layer may be arranged such that they extend in a direction perpendicular to that of the direction in which the strips of a metal layer immediately above or below the given metal layer extend. The strips may further be arranged in parallel bands. The metal layers may comprise repeating patterns of strips. They may further provide customization. Vias may be formed to provide connections between metal layers. Such vias and/or one or more of the metal layers themselves may be used to provide customization.
506 Citations
53 Claims
-
1. A semiconductor device comprising:
-
a substrate;
at least first, second and third metal layers formed over said substrate, said first metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of first metal layer strips extending perpendicular to said first axis; and
wherein said second metal layer comprises a multiplicity of second metal layer strips extending generally parallel to said first axis. - View Dependent Claims (2, 3)
-
-
4. A semiconductor device comprising:
-
a substrate;
at least first, second and third metal layers formed over said substrate, said first metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of first metal layer strips extending perpendicular to said first axis; and
wherein said third metal layer comprises a multiplicity of third metal layer strips extending generally perpendicular to said first axis.
-
-
5. An integrated circuit device comprising:
-
at least first, second and third metal layers;
a first via layer to provide connection between said first metal layer and said second metal layer; and
a second via layer to provide connection between said second metal layer and said third metal layer, wherein at least one of said first metal layer and said second metal layer comprises a repeating pattern of spaced band structures, each band structure comprising a multiplicity of metal layer strips, and wherein at least one of said first via layer, second via layer and third metal layer comprises a custom pattern providing one or more routing connections, at least one of said routing connections comprising at least one of said metal layer strips. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. An integrated circuit device comprising:
-
at least first, second and third metal layers;
a first via layer to provide connection between said first metal layer and said second metal layer; and
a second via layer to provide connection between said second metal layer and said third metal layer, wherein at least one of said first metal layer and said third metal layer comprises a repeating pattern of spaced band structures, each band structure comprising a multiplicity of metal layer strips, and wherein at least one of said first via layer, second via layer and third metal layer comprises a custom pattern providing one or more routing connections, at least one of said routing connections comprising at least one of said metal layer strips. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
-
-
27. A semiconductor device comprising:
-
a substrate;
at least first, second and third metal layers formed over said substrate, said second metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of second metal layer strips extending perpendicular to said first axis; and
at least one via connecting at least one second metal layer strip with said first metal layer underlying said second metal layer;
wherein said third metal layer comprises at least one third metal layer strip extending generally perpendicular to said second metal layer strips and being connected thereto by a via, and wherein said first metal layer comprises a repeating pattern underlying said second metal layer strips. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
-
-
36. A semiconductor device comprising:
-
a substrate;
at least first, second and third metal layers formed over said substrate, said second metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of second metal layer strips extending perpendicular to said first axis; and
at least one via connecting at least one second metal layer strip with said first metal layer underlying said second metal layer;
wherein said third metal layer comprises at least one third metal layer strip extending generally parallel to said second metal layer strips and connecting two coaxial second metal layer strips by vias, and wherein said first metal layer comprises a repeating pattern underlying said second metal layer strips. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44)
-
-
45. A semiconductor device comprising:
-
a substrate;
at least first, second and third metal layers formed over said substrate, said second metal layer comprising a plurality of generally parallel spaced band structures extending parallel to a first axis, each band structure comprising a multiplicity of second metal layer strips extending perpendicular to said first axis; and
at least one via connecting at least one second metal layer strip with said first metal layer underlying said second metal layer;
wherein said first metal layer underlying said second metal layer comprises a multiplicity of first metal layer strips extending generally parallel to said multiplicity of second metal layer strips, and wherein said first metal layer comprises a repeating pattern underlying said second metal layer strips. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53)
-
Specification