Integrated optoelectronic device, and integrated circuit device

• US 6,477,286 B1
• Filed: 07/11/2000
• Issued: 11/05/2002
• Est. Priority Date: 07/16/1999
• Status: Active Grant

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Ouchi, Toshihiko
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): Knauss, Scott A
• Application Number:
  US09/613,624
• Time in Patent Office: 847 Days
• Field of Search: 385/88-94, 385/49, 385/14, 359/152, 257/80-82, 257/98-100, 257/431-435
• US Class Current: 385/14
• CPC Class Codes: G02B 6/10 of the optical waveguide type G02B6/02, G02B6/24 take precedence; devices or arrangements for the control of light by electric, magnetic, electro-magnetic or acoustic means G02F1/00; transferring the modulation of modulated light G02F2/00; optical logic elements G02F3/00; optical analogue/digital converters G02F7/00
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4244 Mounting of the optical elements
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/426 mounting, engaging or coupling of the package to a board, a frame or a panel
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An integrated optoelectronic device includes an electric circuit unit, such as a bare chip of integrated electronic devices, and an optical device unit for performing at least a portion of the input and output of signals to and from the electronic circuit unit via optical signals. The electronic circuit unit and the optical device unit are packaged in a common package with contoured upper, lower and side surfaces, and the optical device unit is provided on a side surface of the package.

Claims

1. An integrated circuit device comprising:

an integrated optoelectronic device including an electrode region formed on a central portion of its bottom surface and an optical device region formed around said electrode region, said electrode region having a protruding configuration; and

a plate member, including an electrical wiring substrate and an optical wiring layer provided on said electrical wiring substrate, said plate member having a recess, and said protruding configuration being inserted in said recess.

2. The integrated circuit device of claim 1, wherein said optical wiring layer is provided on each of upper and lower surfaces of said electrical wiring substrate, and said integrated optoelectronic device is placed on each of said optical wiring layers.

3. The integrated circuit device of claim 2, wherein said electrical wiring substrate has a through-hole waveguide for optically coupling said optical wiring layers one to another.

4. The integrated circuit device of claim 1, wherein said protruding configuration has a height corresponding to a thickness of said optical wiring layer.

5. The integrated circuit device of claim 1, wherein said optical device region comprises a surface light emitting device.

6. The integrated circuit device of claim 1, wherein said optical device region does not contact said plate member.