Card mounted with circuit chip and circuit chip module

• US 6,478,228 B1
• Filed: 06/24/1999
• Issued: 11/12/2002
• Est. Priority Date: 12/27/1996
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Ikefuji, Yoshihiro, Komuro, Toyokazu, Chimura, Shigemi
• Primary Examiner(s): Lee, Michael G.
• Assistant Examiner(s): LE, UYEN CHAU N
• Application Number:
  US09/331,190
• Time in Patent Office: 1,237 Days
• Field of Search: 235/492, 235/487, 235/488, 235/380, 235/382, 235/486, 235/493, 235/441, 235/442, 705/41
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A highly rigid ceramic frame (38) is embedded in a layer of a core member (34). An IC chip (42) is held inside (38a) via an elastic member (40). IC chip 42 arranged inside (38a) will not be greatly deformed even when a strong bending, torsional, or pressing force is applied to the IC card (30). An impact, when exerted on the IC card (30), will not be directly conveyed to the IC chip (42). A coil (44) formed by printing and the like is provided at an upper end face (38b) of the ceramic frame (38). The coil (44) is connected to the IC chip (42) by a wire (46). By forming the IC chip (42), the ceramic frame (38) and the coil (44) integrally in advance, the workability in fabrication is improved. Therefore, a circuit chip mounted card of high reliability and low fabrication cost can be provided.

Claims

1. A circuit chip module configuring a circuit chip mounted card, characterized in that the circuit chip mounted in the card and a reinforcing body to improve card rigidity where said circuit chip is incorporated are integrally coupled,

said reinforcing body including a frame arranged so as to surround the circuit chip in a plane direction perpendicular to a thickness direction of the card, and a tabular member covering at least one side of a cavity surrounded by said frame in the thickness direction,

said circuit chip arranged in a substantially recessed cavity formed by said tabular member and frame.