Semiconductor microsystem embedded in flexible foil
First Claim
1. A microsystem comprising:
- a flexible foil;
a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and
at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;
wherein the flexible foil has a locally anisotropic stiffness of such a nature that the microsystem has locally different degrees of flexibility.
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Accused Products
Abstract
A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.
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Citations
17 Claims
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1. A microsystem comprising:
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a flexible foil;
a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and
at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;
wherein the flexible foil has a locally anisotropic stiffness of such a nature that the microsystem has locally different degrees of flexibility. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A microsystem comprising:
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a flexible foil;
a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and
at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;
wherein the semiconductor elements are at least twice as stiff as the flexible foil.
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16. A microsystem comprising:
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a flexible foil;
a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and
at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;
wherein at least some of the semiconductor elements consist of monocrystalline silicon.
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17. A microsystem comprising:
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a flexible foil;
a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and
at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;
wherein the local stiffness of active regions of the microsystem is lower than the local stiffness of neighboring regions so as to implement a local sensitiveness of the microsystem to deformations.
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Specification