Heat dissipation structure for solid-state light emitting device package
First Claim
1. A heat dissipation structure for a light emitting device comprising:
- a metallic substrate having a top surface and a bottom surface, the top surface configured with a cup-shaped portion for the light emitting device being mounted therein and the bottom surface opposite to the top surface including a metallic solder layer deposited thereon, wherein the cup-shaped portion has an upper surface, an inner surface, and an outer surface, an electrically insulating layer deposited on the upper surface and on the outer surface, an electrically conductive electrode layer deposited on the electrically insulating layer and on the inner surface of the cup-shaped portion, and the electrically conductive electrode layer includes two divided electrodes, the one electrode formed on the inner surface of the cup-shaped portion and the other electrode formed on the upper surface and the outer surface thereof;
an electrically insulating fluidic coolant filled in the cup-shaped portion; and
a light transparent housing hermetically attached to the metallic substrate to seal the electrically insulating fluidic coolant filled in the cup-shaped portion, the light transparent housing having an inner surface configured with a convex portion opposite to the light emitting device.
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Accused Products
Abstract
A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position. Furthermore, the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating. The other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap. Hence if there is any air bubble existing inside the housing due to insufficient filling, it will not dwell in the field of line-of-sight due to buoyancy. The possibility of scattering the LED light due to existing of the bubbles therefore is avoided.
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Citations
6 Claims
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1. A heat dissipation structure for a light emitting device comprising:
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a metallic substrate having a top surface and a bottom surface, the top surface configured with a cup-shaped portion for the light emitting device being mounted therein and the bottom surface opposite to the top surface including a metallic solder layer deposited thereon, wherein the cup-shaped portion has an upper surface, an inner surface, and an outer surface, an electrically insulating layer deposited on the upper surface and on the outer surface, an electrically conductive electrode layer deposited on the electrically insulating layer and on the inner surface of the cup-shaped portion, and the electrically conductive electrode layer includes two divided electrodes, the one electrode formed on the inner surface of the cup-shaped portion and the other electrode formed on the upper surface and the outer surface thereof;
an electrically insulating fluidic coolant filled in the cup-shaped portion; and
a light transparent housing hermetically attached to the metallic substrate to seal the electrically insulating fluidic coolant filled in the cup-shaped portion, the light transparent housing having an inner surface configured with a convex portion opposite to the light emitting device. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification