Via plug layout structure for connecting different metallic layers

• US 6,483,045 B1
• Filed: 07/26/2000
• Issued: 11/19/2002
• Est. Priority Date: 02/03/2000
• Status: Expired due to Fees

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Liu, Yuan-Chang, Wang, Mu-Chun, Kao, Shih-Chieh, Huang-Lu, Shiang
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): ALCALA, JOSE H
• Application Number:
  US09/626,409
• Time in Patent Office: 846 Days
• Field of Search: 174/262, 174/263, 174/264, 174/265, 174/260, 361/792, 361/793, 361/794, 361/795, 361/780, 361/784, 361/803, 257/698, 257/669, 333/246
• US Class Current: 174/264
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0769 Anti metal-migration, e.g. avoiding tin whisker growth
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points

Abstract

A via plug layout structure for connecting different metallic layers. The structure includes a plurality of via plugs arranged in a fan-shaped pattern and a plurality of empty bars positioned between a single via plug and the fanned-out via plugs so that incoming current to the single via plug is equally distributed to every one of the fanned-out via plug and current stress in each fanned-out via plug is identical. Hence, via plugs having particularly serious electromigration problem can be discovered. In addition, single via plug having different critical dimension can be fabricated so that maximum critical dimension sustainable by the via plug is determined after an electromigration test.

Claims

1. A via plug layout structure to connect different metallic layers, comprising:

a first metallic layer;

a third metallic layer;

a dielectric layer, formed over the first and third metallic layers;

a first via plug, formed through the dielectric layer and electrically connected to the first metallic layer;

a second metallic layer, formed over the dielectric layer and electrically connected to the first via plug; and

a plurality of second via plugs, arranged through the dielectric layer in a fan-shaped pattern radially away from the first via plug, and electrically connected to the second and third metallic layers.

2. The via plug layout structure of claim 1, wherein each second via plug is separated from the first via plug by an identical distance.

3. The via plug layout structure of claim 1, wherein the third metallic layer is another section of the first metallic layer.

4. A via plug layout structure to connect different metallic layers, comprising:

a first metallic layer;

a third metallic layer;

a dielectric layer, formed over the first metallic layer and the third metallic layer;

a first via plug, formed through the dielectric layer and electrically connected to the first metallic layer;

a second metallic layer, formed over the dielectric layer and electrically connected to the first via plug;

a plurality of second via plugs, arranged through the dielectric layer in a fan-shaped pattern radially away from the first via plug, and electrically connected to the second and third metallic layers, wherein each second via plug is located at a first distance away from the first via plug; and

a plurality of first empty bars, positioned in an upper surface of the second metallic layer between the first via plug and the second via plugs to divert incoming current.

5. The via plug layout structure of claim 4, wherein the first empty bars and the second via plugs are about equal in number, and each first empty bar is placed at an identical distance away from both the first via plug and a corresponding second via plug.

6. The via plug layout structure of claim 4, wherein the structure further includes:

a fourth metallic layer over the dielectric layer;

a third via plug, formed through the dielectric layer and electrically connected to the third metallic layer and the fourth metallic layer; and

a plurality of fourth via plugs, arranged through the dielectric layer in a fan-shaped pattern radially away from the third via plug, and electrically connected to the fourth metallic layer, wherein each fourth via plug is at a second distance away from the third via plug.

7. The via plug layout structure of claim 6, wherein the structure further includes a plurality of second empty bars positioned in an upper surface of the fourth metallic layer between the third via plug and the fourth via plugs to divert incoming current.

8. The via plug layout structure of claim 7, wherein the second empty bars and the fourth via plugs are equal in number, and each second empty bar is placed at an identical distance away from both the third via plug and a corresponding fourth via plug.

9. The via plug layout structure of claim 6, wherein each fourth via plug is separated from the third via plug by an identical second distance.

10. The via plug layout structure of claim 6, wherein the fourth via plugs and the second via plugs are different in number.

11. The via plug layout structure of claim 6, wherein a critical dimension of the third via plug is different from a critical dimension of the first via plug.

12. The via plug layout structure of claim 6, wherein the fourth metallic layer is a section of the second metallic layer.