Semiconductor device

• US 6,483,365 B2
• Filed: 03/19/2002
• Issued: 11/19/2002
• Est. Priority Date: 08/02/2000
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Corporation
• Inventors: Morishita, Yasuyuki
• Primary Examiner(s): LAM, TUAN THIEU
• Application Number:
  US10/100,846
• Publication Number:
  US 20020105368A1
• Time in Patent Office: 245 Days
• Field of Search: 327/309, 327/310, 327/314, 327/318, 327/319, 327/320, 327/321, 327/324, 327/327, 327/328, 361/56, 361/91.5, 361/91.6, 361/91.7, 361/93.1
• US Class Current: 327/314
• CPC Class Codes: H01L 27/0266 using field effect transistors as protective elements
• CPC Class Codes: H03F 1/523 for amplifiers using field-effect devices H03F1/526 takes precedence

Abstract

A semiconductor device is provided with a signal terminal, a high potential side power supply terminal, a low potential side power supply terminal, a first wiring connected to the high potential side power supply terminal, a second wiring connected to the low potential side power supply terminal, and an internal circuit to which power is supplied from the first and second wirings. Further the semiconductor device is provided with a first and a second resistance elements whose one end is connected to a first node, a first protection element having a first terminal connected to the first wiring and a second terminal connected to the other end of the first resistance element, a second protection element having a third terminal connected to the other end of the second resistance element and a fourth terminal connected to the second wiring, and a third protection element having a fifth terminal connected to the first wiring and a sixth terminal connected to the second wiring.

Claims

1. A semiconductor device comprising:

a signal terminal;

a high potential side power supply terminal;

a low potential side power supply terminal;

a first wiring connected to said high potential side power supply terminal;

a second wiring connected to said low potential side power supply terminal;

an internal circuit to which power is supplied from said first and said second wirings;

first and second resistance elements whose each one end is connected to a first node, said first node being at a wiring connecting said signal terminal with said internal circuit;

a first protection element having a first terminal connected to said first wiring and a second terminal connected to the other end of said first resistance element, voltage-current characteristics of said first protection element when said second terminal is grounded having a negative resistance region and a holding region;

a second protection element having a third terminal connected to the other end of said second resistance element and a fourth terminal connected to said second wiring, voltage-current characteristics of said second protection element when said fourth terminal is grounded having a negative resistance region and a holding region;

a third protection element having a fifth terminal connected to said first wiring and a sixth terminal connected to said second wiring, said third protection element being made up of a MOS transistor, and voltage-current characteristics of said third protection element when said sixth terminal is grounded having a negative resistance region and a holding region;

a fourth protection element made up of a diode whose anode is connected to a second node and whose cathode is connected to said first wiring, said second node being at said wiring connecting said signal terminal with said internal circuit, and the relations of “

Vh2(I1)+r2×

I1≧

Vf4+Vr3>

Vr2” and

“

Id2>

I1”

being satisfied, where

I1 represents a value of a first current flowing from said signal terminal to said low potential side power supply terminal via said second resistance element, said second protection element and said second wiring,

Id2 represents a value of said first current when it causes destruction of said second protection element,

r2 represents a resistance value of said second resistance element,

Vf4 represents a voltage when a current starts to flow through said fourth protection element in case that a positive voltage is applied to said anode of said fourth protection element while grounding said cathode of said fourth protection element,

Vh2(I1) represents a voltage drop of said second protection element caused by said first current,

Vr2 represents a negative resistance starting voltage in said negative resistance region of said second protection element, and

Vr3 represents a negative resistance starting voltage in said negative resistance region of said third protection element; and

a fifth protection element made up of a diode whose cathode is connected to said second node and whose anode is connected to said second wiring.

2. The semiconductor device according to claim 1, wherein said second node is at a position closer to said signal terminal than said first node.

3. The semiconductor device according to claim 1, wherein said third protection element is made up of an n-channel MOS transistor having a drain as said fifth terminal, a source of said sixth terminal, and a gate connected to said source.

4. The semiconductor device according to claim 1, wherein said first protection element is made up of a p-channel MOS transistor having a source as said first terminal, a drain as said second terminal, and a gate connected to said source, and said second protection element is made up of an n-channel MOS transistor having a drain as said third terminal, a source as said fourth terminal, and a gate connected to said source.

5. The semiconductor device according to claim 1, wherein said anode of said diode is made up of a p-well diffused region, and said cathode of said diode is made up of an n-well diffused region.

6. A semiconductor device comprising:

a signal terminal

a high potential side power supply terminal;

a low potential side power supply terminal;

a first wiring connected to said high potential side power supply terminal;

a second wiring connected to said low potential side power supply terminal;

an internal circuit to which power is supplied from said first and said second wirings;

first and second resistance elements whose each one end is connected to a first node, said first node being at a wiring connecting said signal terminal with said internal circuit;

a first protection element having a first terminal connected to said first wiring and a second terminal connected to the other end of said first resistance element, voltage-current characteristics of said first protection element when said second terminal is grounded having a negative resistance region and a holding region;

a second protection element having a third terminal connected to the other end of said second resistance element and a fourth terminal connected to said second wiring, voltage-current characteristics of said second protection element when said fourth terminal is grounded having a negative resistance region and a holding region;

a third protection element having a fifth terminal connected to said first wiring and a sixth terminal connected to said second wiring, said third protection element being made up of a MOS transistor, and voltage-current characteristics of said third protection element when said sixth terminal is grounded having a negative resistance region and a holding region;

a fourth protection element made up of a diode whose anode is connected to a second node and whose cathode is connected to said first wiring, said second node being at said wiring connecting said signal terminal with said internal circuit; and

a fifth protection element made up of a diode whose cathode is connected to said second node and whose anode is connected to said second wiring, the relations of “

Vh1(I2)+r1×

I2≧

Vf5+Vr3>

Vr1” and

“

Id1>

I2”

being satisfied, where

I2 represents a value of a second current flowing from said high potential side power supply terminal to said signal terminal via said first wiring, said first protection element and said first resistance element,

Id1 represents a value of said second current when it causes destruction of said first protection element,

r1 represents a resistance valve of said first resistance element,

Vf5 represents a voltage when a current starts to flow through said fifth protection element in case that a positive voltage is applied to said anode of said fifth protection element while grounding said cathode of said fifth protection element,

Vh1(I2) represents a voltage drop of said first protection element caused by said second current,

Vr1 represents a negative resistance starting voltage in said negative resistance region of said first protection element, and

Vr3 represents a negative resistance starting voltage in said negative resistance region of said third protection element.

7. The semiconductor device according to claim 6, wherein said second node is at a position closer to said signal terminal than said first node.

8. The semiconductor device according to claim 6, wherein said third protection element is made up of an n-channel NOS transistor having a drain as said fifth terminal, a source as said sixth terminal, and a gate connected to said source.

9. The semiconductor device according to claim 6, wherein said first protection element is made up of a p-channel MOS transistor having a source as said first terminal, a drain as said second terminal, and a gate connected to said source, and said second protection element is made up of an n-channel MOS transistor having a drain as said third terminal, a source as said fourth terminal, and a gate connected to said source.

10. The semiconductor device according to claim 6, wherein said anode of said diode is made up of a p-well diffused region, and said cathode of said diode is made up of an n-well diffused region.