Electronic module including a cooling substrate and related methods

• US 6,483,705 B2
• Filed: 03/19/2001
• Issued: 11/19/2002
• Est. Priority Date: 03/19/2001
• Status: Expired due to Term

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Newton, Charles Michael, Snyder, Steven Robert, Lange, Michael Ray
• Primary Examiner(s): Schuberg, Darren
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/811,827
• Publication Number:
  US 20020131237A1
• Time in Patent Office: 610 Days
• Field of Search: 361/687, 361/689, 361/704, 361/707, 361/709, 361/699, 361/700, 174/15.1, 174/15.2, 174/252, 257/707-727, 165/80.2, 165/80.3, 165/46, 165/104.33, 165/106.26, 165/104.34, 165/126, 165/133, 165/911
• US Class Current: 361/709
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Claims

1. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber;

said cooling substrate comprising projections extending inwardly into said at least one cooling fluid passageway for facilitating cooling fluid flow by capillary action;

an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device; and

at least one condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink;

said evaporator thermal transfer body and said at least one condenser thermal transfer body each having a higher thermal conductivity than adjacent cooling substrate portions.

2. The electronic module of claim 1 wherein said evaporator thermal transfer body, said at least one condenser thermal transfer body, and said at least one cooling fluid passageway cause fluid flow during operation of the electronic module without a pump.

3. The electronic module of claim 1 wherein said evaporator thermal transfer body comprises a wicking portion exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action.

4. The electronic module of claim 3 wherein said wicking portion comprises a plurality of projections.

5. The electronic module of claim 4 wherein said plurality of projections are arranged in a generally rectangular pattern.

6. The electronic module of claim 3 wherein said evaporator thermal transfer body further comprises a base plate carrying said wicking portion for facilitating sealing with adjacent cooling substrate portions.

7. The electronic module of claim 1 wherein said at least one condenser thermal transfer body comprises at least one wicking portion exposed within said at least one condenser chamber for facilitating cooling fluid flow by capillary action.

8. The electronic module of claim 7 wherein said at least one condenser thermal transfer body comprises a reservoir portion adjacent said at least one wicking portion defining a cooling fluid reservoir.

9. The electronic module of claim 7 wherein said at least one wicking portion comprises at least one base and a plurality of projections extending outwardly therefrom.

10. The electronic module of claim 9 wherein said plurality of projections are arranged in two generally rectangular groups oriented at a substantially right angle.

11. The electronic module of claim 9 wherein each of said projections comprises a reduced width tip portion.

12. The electronic module of claim 7 wherein said at least one condenser thermal transfer body further comprises a base plate carrying said at least one wicking portion for facilitating sealing with adjacent cooling substrate portions.

13. The electronic module of claim 1 wherein said cooling substrate further comprises projections extending inwardly into said evaporator chamber and said at least one condenser chamber for facilitating cooling fluid flow by capillary action.

14. The electronic module of claim 1 wherein each of said evaporator and at least one condenser thermal transfer bodies comprise metal;

and wherein said cooling substrate comprises ceramic.

15. The electronic module of claim 1 wherein said evaporator thermal transfer body and said at least one condenser thermal transfer body are resistant to corrosion from the cooling fluid.

16. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and

an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device, said evaporator thermal transfer body comprising a wicking portion comprising a plurality of projections exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action;

said evaporator thermal transfer body having a higher thermal conductivity than adjacent cooling substrate portions.

17. The electronic module of claim 16 wherein said plurality of projections are arranged in a generally rectangular pattern.

18. The electronic module of claim 16 wherein said evaporator thermal transfer body further comprises a base plate carrying said wicking portion for facilitating sealing with adjacent cooling substrate portions.

19. The electronic module of claim 16 wherein said evaporator thermal transfer body comprises metal;

and wherein said cooling substrate comprises ceramic.

20. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and

at least one condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink, said at least one condenser thermal transfer body comprising at least one wicking portion exposed within said at least one condenser chamber for facilitating cooling fluid flow by capillary action, said at least one wicking portion comprising at least one base and a plurality of projections extending outwardly therefrom;

said at least one condenser thermal transfer body having a higher thermal conductivity than adjacent cooling substrate portions.

21. The electronic module of claim 20 wherein said at least one condenser thermal transfer body comprises a reservoir portion adjacent said at least one wicking portion defining a cooling fluid reservoir.

22. The electronic module of claim 20 wherein said plurality of projections are arranged in two generally rectangular groups oriented at a substantially right angle.

23. The electronic module of claim 20 wherein each of said projections comprises a reduced width tip portion.

24. The electronic module of claim 20 wherein said at least one condenser thermal transfer body further comprises a base plate carrying said at least one wicking portion for facilitating sealing with adjacent cooling substrate portions.

25. The electronic module of claim 20 wherein said at least one condenser thermal transfer body comprises metal;

and wherein said cooling substrate comprises ceramic.

26. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber, said cooling substrate comprising projections extending inwardly into said at least one cooling fluid passageway for facilitating cooling fluid flow by capillary action; and

an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device;

said evaporator thermal transfer body having a thermal conductivity of greater than about 100 Watts per meter-degree Celsius.

27. The electronic module of claim 26 wherein said evaporator thermal transfer body comprises a wicking portion exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action.

28. The electronic module of claim 27 wherein said evaporator thermal transfer body further comprises a base plate carrying said wicking portion for facilitating sealing with adjacent cooling substrate portions.

29. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber, said cooling substrate comprising projections extending inwardly into said at least one cooling fluid passageway for facilitating cooling fluid flow by capillary action; and

at least one condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink;

said at least one condenser thermal transfer body having a thermal conductivity of greater than about 100 Watts per meter-degree Celsius.

30. The electronic module of claim 29 wherein said at least one condenser thermal transfer body comprises at least one wicking portion exposed within said at least one condenser chamber for facilitating cooling fluid flow by capillary action.

31. The electronic module of claim 30 wherein said at least one condenser thermal transfer body further comprises a base plate carrying said at least one wicking portion for facilitating sealing with adjacent cooling substrate portions.

32. A method for making an electronic module comprising:

forming a cooling substrate having an evaporator chamber, at least one condenser chamber, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber;

mounting an electronic device on the cooling substrate adjacent the electronic device;

connecting an evaporator thermal transfer body in thermal communication between the evaporator chamber and the electronic device, the evaporator thermal transfer body having a higher thermal conductivity than adjacent cooling substrate portions, the evaporator thermal transfer body comprising a wicking portion comprising a plurality of projections exposed within the evaporator chamber for facilitating cooling fluid flow by capillary action; and

connecting a heat sink to the cooling substrate adjacent the at least one condenser chamber.

33. The method of claim 32 wherein the plurality of projections are arranged in a generally rectangular pattern.

34. The method of claim 32 wherein the evaporator thermal transfer body further comprises a base plate carrying the wicking portion for facilitating sealing with adjacent cooling substrate portions.

35. The method of claim 32 wherein the evaporator thermal transfer body comprises metal;

and wherein the cooling substrate comprises ceramic.

36. A method for making an electronic module comprising:

forming a cooling substrate having an evaporator chamber, at least one condenser chamber, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber;

mounting an electronic device on the cooling substrate adjacent the evaporator chamber;

connecting at least one condenser thermal transfer body in thermal communication between the at least one condenser chamber, the at least one condenser thermal transfer body having a higher thermal conductivity than adjacent cooling substrate portions and comprising at least one wicking portion exposed within the at least one condenser chamber for facilitating cooling fluid flow by capillary action, the at least one wicking portion comprising at least one base and a plurality of projections extending outwardly therefrom; and

connecting a heat sink to the cooling substrate adjacent the at least one condenser chamber.

37. The method of claim 36 wherein the at least one condenser thermal transfer body comprises a reservoir portion adjacent the at least one wicking portion defining a cooling fluid reservoir.

38. The method of claim 36 wherein the plurality of projections are arranged in two generally rectangular groups oriented at a substantially right angle.

39. The method of claim 36 wherein each of the projections comprises a reduced width tip portion.

40. The method of claim 36 wherein the at least one condenser thermal transfer body further comprises a base plate carrying the at least one wicking portion for facilitating sealing with adjacent cooling substrate portions.

41. The method of claim 36 wherein the at least one condenser thermal transfer body comprises metal;

and wherein the cooling substrate comprises ceramic.

47. The electronic module of claim 41 wherein said cooling substrate further comprises projections extending inwardly into said cooling fluid passageways for facilitating cooling fluid flow by capillary action.

42. An electronic module comprising:

a cooling substrate and an electronic device mounted thereon;

a heat sink adjacent said cooling substrate;

said cooling substrate having an evaporator chamber adjacent said electronic device, a plurality of spaced apart condenser chambers adjacent said heat sink, and respective cooling fluid passageways connecting said evaporator chamber in fluid communication with said spaced apart condenser chambers;

an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device; and

a respective condenser thermal transfer body connected in thermal communication between each condenser chamber and said heat sink;

said evaporator thermal transfer body and said condenser thermal transfer bodies each having a higher thermal conductivity than adjacent cooling substrate portions.

43. The electronic module of claim 42 wherein said evaporator thermal transfer body comprises a wicking portion exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action.

44. The electronic module of claim 43 wherein said wicking portion comprises a plurality of projections.

45. The electronic module of claim 42 wherein each condenser thermal transfer body comprises at least one wicking portion exposed within its respective condenser chamber for facilitating cooling fluid flow by capillary action.

46. The electronic module of claim 45 wherein said at least one wicking portion comprises at least one base and a plurality of projections extending outwardly therefrom.