Conforming shielded form for electronic component assemblies

• US 6,483,719 B1
• Filed: 03/21/2000
• Issued: 11/19/2002
• Est. Priority Date: 03/21/2000
• Status: Expired due to Fees

• Current Assignee: PPG Industries Ohio Incorporated (Nouryon BV)
• Original Assignee: Spraylat Corporation
• Inventors: Bachman, Bruce
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US09/531,745
• Time in Patent Office: 973 Days
• Field of Search: 361/752, 361/800, 361/816, 361/818, 361/814, 174/35.R, 174/35.MS, 455/90, 455/300, 252/500, 298/56
• US Class Current: 361/816
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/34 by soldering
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: H05K 9/0029 made from non-conductive materials intermixed with electro-conductive particles H05K9/0031 takes precedence
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49988 Metal casting

Abstract

The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source. The conforming shield enclosure comprises a flexible, metalized thermoformable polymer having dimensions conforming to the inside of the housing and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies. The conforming shield enclosure is prepared by paint metalization.

Claims

1. A shielded electronic component assembly consisting of:

(a) a semiconductor device to be shielded from electromagnetic frequencies;

(b) a reference potential source;

(c) a housing enclosing the semiconductor device within the assembly; and

(d) a conforming shield enclosure electrically connected to the reference potential source, wherein the conforming shield enclosure comprises a metalized thermoformable polymer having dimensions conforming to the inside of the housing and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.

2. The shielded electronic component assembly according to claim 1, wherein the electronic component assembly is selected from the group consisting of cellular phones, notebook computers, electronic enclosures, printed circuit boards, and printed circuit board integrated components.

3. The shielded electronic component assembly according to claim 1, wherein the thermoformable polymer is selected from the group consisting of polycarbonate, polyacrylate, polyethylene terephthalate glycol, polyvinyl chloride, styrene, polyester, and mixtures thereof.

4. The shielded electronic component assembly according to claim 3, wherein the thermoformable polymer is polycarbonate.

5. The shielded electronic component assembly according to claim 1, wherein the thermoformable polymer has a thickness from about 0.005 inch to about 0.100 inch.

6. The shielded electronic component assembly according to claim 5, wherein the thermoformable polymer is polycarbonate having a thickness from about 0.005 inch to about 0.025 inch.

7. The shielded electronic component assembly according to claim 1, wherein the metalized thermoformable polymer comprises metal particles selected from the group consisting of copper, silver, cobalt, titanates, niobates, zirconates, nickel, gold, tin, aluminum, magnesium, and alloys thereof.

8. The shielded electronic component assembly according to claim 1, wherein the metalized thermoformable polymer comprises metal particles selected from the group consisting of iron, silver, nickel, ferrites, cobalt, chromium, magnesium, magnetic oxides, and alloys thereof.

9. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on an inside portion of the conforming shield enclosure.

10. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on an outside portion of the conforming shield enclosure.

11. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on both an inside and an outside portion of the conforming shield enclosure.

12. The shielded electronic component assembly according to claim 1, further comprising a plurality of semiconductor devices, wherein the conforming shield enclosure encloses and shields each of the plurality of semiconductor devices.

13. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure further comprises integrated thermoforming gasketing dots to provide a positive and constant pressure contact along a ground trace path of a printed circuit board and a specific integrated gasket path along a ground trace of a printed circuit board.

14. The shielded electronic component assembly according to claim 13, wherein the gasketing dots provide a 0.5 to 1 inch wide gold plated grounding path.

15. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure comprises a crease/hinge/fold design to provide up to a 360 degree bend in the substrate.

16. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure comprises a zero-draft fold design having a crease designed onto a hinge with 4 edge slits placed at quadrants parallel to a creased-hinge to provide up to a 270 degree bend in the substrate.

17. The shielded electronic component assembly according to claim 1, wherein the conforming shield enclosure encloses and shields the semiconductor device from electromagnetic frequencies and is attached by an adhesive or a conductive adhesive.