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Platen arrangement for a chemical-mechanical planarization apparatus

  • US 6,485,359 B1
  • Filed: 09/15/2000
  • Issued: 11/26/2002
  • Est. Priority Date: 09/15/2000
  • Status: Expired due to Fees
First Claim
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1. A platen for a fixed abrasive pad chemical-mechanical polishing/planarization arrangement, comprising:

  • a platen housing;

    a sub-structure integrally mounted on the platen housing; and

    a vacuum mounting arrangement configured to removably mount a fixed abrasive layer to the sub-structure, wherein the vacuum mounting arrangement includes suction holes at a top surface of the sub-structure vacuum connections through the sub-structure configured to connect the suction holes to a vacuum source, wherein the sub-structure includes a bottom cushion layer and an upper structural layer on the cushion layer.

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