Method for manufacturing laminated-ceramic electronic components

• US 6,485,591 B1
• Filed: 08/04/1994
• Issued: 11/26/2002
• Est. Priority Date: 03/07/1988
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakao, Keiichi, Miura, Yoshiyuki, Katoh, Masahiro, Iguchi, Takashi, Okuyama, Hikoji, Ohmi, Akira, Horibe, Yasutaka, Okinaka, Hideyuki
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US08/286,098
• Time in Patent Office: 3,036 Days
• Field of Search: 156/89, 156/233, 156/238, 156/240, 156/242, 156/246, 156/247, 156/235, 156/89.12, 156/89.16, 118/56, 118/63
• US Class Current: 156/89.12
• CPC Class Codes: B28B 19/0015 on multilayered articles
• CPC Class Codes: C04B 2111/00844 for electronic applications
• CPC Class Codes: C04B 41/4511 using temporarily supports, e.g. decalcomania transfers or mould surfaces
• CPC Class Codes: C04B 41/4578 Coating or impregnating of green ceramics or unset concrete
• CPC Class Codes: C04B 41/5194 Metallisation of multilayered ceramics, e.g. for the fabrication of multilayer ceramic capacitors
• CPC Class Codes: H01C 7/10 voltage responsive, i.e. varistors
• CPC Class Codes: H01G 4/308 made by transfer techniques
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: H10N 30/053 by integrally sintering piezoelectric or electrostrictive bodies and electrodes
• CPC Class Codes: H10N 30/067 Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts

Abstract

The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.

Claims

1. A method for manufacturing laminated-ceramic electronic components, comprising the steps of:

a. forming a first plurality of electrodes on a first support;

b. forming, on the first support, a first ceramic greenware sheet with the first plurality of electrodes embedded therein by applying a ceramic slurry onto the first plurality of electrodes;

c. laminating the first ceramic greenware sheet in contact with a surface of a second ceramic greenware sheet by pressing the first ceramic greenware sheet via the first support and heating the first ceramic greenware sheet;

d. peeling off the first support from the first ceramic greenware sheet being laminated;

e. forming a second plurality of electrodes on a second support;

f. forming, on the second support, a third ceramic greenware sheet with the second plurality of electrodes embedded therein by applying a ceramic slurry onto the second plurality of electrodes;

g. laminating the third ceramic greenware sheet in contact with a surface of the first greenware sheet from which the first support has been peeled off by pressing the third ceramic greenware sheet via the second support and heating the third ceramic greenware sheet to form a ceramic laminated structure having the second support;

h. peeling off the second support from the ceramic laminated structure; and

i. sintering the ceramic laminated structure.

2. A method for manufacturing laminated-ceramic electronic components according to claim 1, wherein the ceramic greenware sheet with electrodes embedded therein is smoothed on its surface.

3. A method for manufacturing laminated-ceramic electronic components according to claim 2, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by blowing off air, in a direction not perpendicular to the surface of the ceramic slurry, onto the ceramic slurry which has been applied onto the electrodes.

4. A method for manufacturing laminated-ceramic electronic components according to claim 2, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by slanting the ceramic slurry, which has been applied onto the electrodes, together with the support.

5. A method for manufacturing laminated-ceramic electronic components according to claim 2, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by applying a ceramic slurry onto the electrodes by means of a doctor blade or an applicator which has regular unevenness on the application surface thereof.

6. A method for manufacturing laminated-ceramic electronic components according to claim 1, wherein the laminated-ceramic electronic components mean laminated-ceramic capacitors, multi-layered ceramic circuit substrates, laminated varistors or laminated-piezoelectric elements, or compounds thereof.

7. A method for manufacturing laminated-ceramic electronic components according to claim 1, wherein the ceramic greenware sheet with electrodes embedded therein contains a thermoplastic resin in the range of 10 to 40% by weight.

8. A method for manufacturing a laminated-ceramic capacitor, comprising the steps of:

a. forming a first plurality of electrodes on a first support;

b. forming, on the first support, a first ceramic greenware sheet with the first plurality of electrodes embedded therein by applying a ceramic slurry onto the first plurality of electrodes, the first ceramic greenware sheet having a thickness of 20 micrometers or less;

c. laminating the first ceramic greenware sheet in contact with a surface of a second greenware sheet by pressing the first ceramic greenware sheet via the first support and heating the first ceramic greenware sheet;

d. peeling off the first support from the first ceramic greenware sheet being laminated;

e. forming a second plurality of electrodes on a second support;

f. forming, on the second support, a third ceramic greenware sheet with the second plurality of electrodes embedded therein by applying a ceramic slurry onto the second plurality of electrodes;

g. laminating the third ceramic greenware sheet in contact with a surface of the first ceramic greenware sheet from which the first support has been peeled off by pressing the third ceramic greenware sheet via the second support and heating the third ceramic greenware sheet to form a ceramic laminated structure having the second support;

h. peeling off the second support from the ceramic laminated structure; and

i. sintering the laminated structure.

9. A method for manufacturing a laminated-ceramic capacitor according to claim 8, wherein the ceramic greenware sheet with electrodes embedded therein is smoothed on its surface.

10. A method for manufacturing a laminated-ceramic capacitor according to claim 9, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by blowing air in a direction not perpendicular to the surface of the ceramic slurry, onto the ceramic slurry which has been applied onto the electrodes.

11. A method for manufacturing a laminated-ceramic capacitor according to claim 9, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by slanting the ceramic slurry applied onto the electrodes together with the support.

12. A method for manufacturing a laminated-ceramic capacitor according to claim 9, wherein the smoothness of the surface of the ceramic greenware sheet with electrodes embedded therein is achieved by applying a ceramic slurry onto the electrodes by a doctor blade or an applicator which has regular unevenness on the coating surface thereof.

13. A method for manufacturing a laminated-ceramic capacitor according to claim 8, wherein the ceramic greenware sheet with electrodes embedded therein contains a thermoplastic resin in an amount of about 10 to about 40 percent by weight.