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Method of reducing substrate coupling for chip inductors by creation of dielectric islands by selective EPI deposition

  • US 6,486,017 B1
  • Filed: 06/04/2002
  • Issued: 11/26/2002
  • Est. Priority Date: 06/04/2002
  • Status: Expired due to Term
First Claim
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1. A method of reducing substrate coupling for an inductor created over the surface of a high resistivity substrate, comprising the steps of:

  • providing a substrate;

    depositing a first layer of dielectric over the surface of said substrate;

    patterning and etching said first layer of dielectric, creating openings through said first layer of dielectric, further creating a pattern of first dielectric overlying said substrate and being aligned with coils of a thereover to be created inductor;

    filling said openings created through said first layer of dielectric with epitaxial silicon;

    depositing a second layer of dielectric over the surface of said pattern of first dielectric, thereby including the surface of said filling of epitaxial silicon;

    depositing a third layer of dielectric over the surface of said second layer of dielectric; and

    creating a horizontal spiral inductor over the surface of said third layer of dielectric.

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