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Integrated circuit die having an interference shield

  • US 6,486,534 B1
  • Filed: 02/16/2001
  • Issued: 11/26/2002
  • Est. Priority Date: 02/16/2001
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit package, comprising:

  • an integrated circuit including a first circuit, and at least one second circuit, the first circuit being surrounded on lateral sides by a plurality of conductive vias; and

    a package substrate having a ground plane, whereby the conductive vias and ground plane protect the second circuit from electromagnetic interference wherein the integrated circuit includes a plurality of metal layers and wherein the vias extend through all of the metal layers, wherein the integrated circuit further includes a semiconductor substrate above the metal layers, wherein the semiconductor substrate is on a top end and the metal layers are on a bottom end, the bottom end being adjacent the package substrate.

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