Semiconductor module and power converting apparatus using the module

• US 6,486,548 B1
• Filed: 04/20/2000
• Issued: 11/26/2002
• Est. Priority Date: 10/20/1997
• Status: Expired due to Term

• Current Assignee: Hitachi Keiyo Engineering Company Limited, Hitachi, Ltd.
• Original Assignee: Hitachi Keiyo Engineering Company Limited, Hitachi, Ltd.
• Inventors: Ito, Kazuhiro, Suzuki, Norinaga, Tamba, Akihiro, Tomita, Hiroyuki, Fujii, Hiroshi, Hiraga, Masahiro, Nakatsu, Kinya, Ogawa, Toshio
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US09/529,800
• Time in Patent Office: 950 Days
• Field of Search: 257/678-733, 257/787-796
• US Class Current: 257/690
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.

Claims

1. A semiconductor module with a semiconductor element mounted thereon, comprising:

a connector in which a lead electrode is covered with a resin member separated from a semiconductor module case, and said lead electrode is provided with a wiring bonding pad bonding-connectable to a metal wire to connect said lead electrode to said semiconductor element, said resin member of the connector being bonded to the module.

2. The semiconductor module according to claim 1 wherein in said lead electrode, said pad is provided on a surface opposite to a contact surface of the lead electrode and said resin member.

3. The semiconductor module according to claim 1 wherein said lead electrode is bent with respect to said pad surface.

4. The semiconductor module according to claim 2 wherein the thickness of said resin member between said contact surface and the bonded part of said resin member in said module is in a range of 1 mm to 20 mm.

5. The semiconductor module according to claim 1 comprising:

means for positioning said connector in the module.

6. The semiconductor module according to claim 1 wherein said connector is a connector for connecting a substrate on which an electric circuit component is mounted.

7. The semiconductor module according to claim 1 further comprising:

a substrate with an electric circuit component mounted thereon, said substrate being positioned over said semiconductor element, sand substrate being connected to said connector.

8. The semiconductor module according to claim 7 wherein said substrate is disconnectably connected to said connector.

9. The semiconductor module according to claim 1 comprising:

a plurality of said connectors, the plurality of said connectors including a first connector, and a second connector higher than the first connector; and

a substrate with an electric circuit component mounted thereon, said substrate being positioned over said semiconductor element, said substrate being connected to said first connector.

10. The semiconductor module according to claim 9 wherein said substrate is disconnectably connected to said first connector.

11. A power converting apparatus comprising:

the semiconductor module according to claim 1; and

a substrate with an electric circuit component mounted thereon,

said substrate being positioned above said semiconductor module, said substrate being connected to said connector.

12. A power converting apparatus comprising:

the semiconductor module according to claim 9; and

another substrate with an electric circuit component mounted thereon,

said another substrate being positioned above said semiconductor module, said another substrate being connected to said second connector.

13. The power converting apparatus according to claim 12 wherein said another substrate is disconnectably connected to said second connector.

14. A semiconductor module according to claim 1 wherein said semiconductor module case is comprised of resin.