Semiconductor light emitting element formed on a clear or translucent substrate
First Claim
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1. A semiconductor illumination device for providing illuminating an object, comprising:
- a unitary substrate adapted to extend over the object;
a plurality of conductors deposited on the substrate; and
a light emitting element formed as a packageless semiconductor junction attached to said conductors and oriented on said substrate to direct radiation toward the object.
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Abstract
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
30 Citations
18 Claims
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1. A semiconductor illumination device for providing illuminating an object, comprising:
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a unitary substrate adapted to extend over the object;
a plurality of conductors deposited on the substrate; and
a light emitting element formed as a packageless semiconductor junction attached to said conductors and oriented on said substrate to direct radiation toward the object. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor illumination device comprising:
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a transparent substrate;
a plurality of conductors deposited on said substrate;
a plurality of light emitting elements attached to said substrate and connected to said conductors to receive excitation signals, said light emitting elements being formed of packageless semiconductor junction. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A semiconductor illumination device for illuminating an object comprising:
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a substrate arranged to disposed over said object;
a plurality of conductors deposited on said substrate; and
a light emitting element attached to said substrate and connected to said conductors to receive excitation signals, said light emitting element being formed of a packageless semiconductor junction. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification