Traveling-wave valve arrangement

• US 6,486,604 B1
• Filed: 03/29/2000
• Issued: 11/26/2002
• Est. Priority Date: 04/23/1998
• Status: Expired due to Fees

• Current Assignee: Thales Electron Devices GmbH (Thales SA)
• Original Assignee: Thales Electron Devices GmbH (Thales SA)
• Inventors: Peters, Andreas, Bradatsch, Hubert
• Primary Examiner(s): Lee, Benny T.
• Application Number:
  US09/509,517
• Time in Patent Office: 972 Days
• Field of Search: 315/3.5, 313/45, 313/46, 330/43, 330/149
• US Class Current: 315/3.5
• CPC Class Codes: H01J 23/005 Cooling methods or arrangements H01J23/033 takes precedence
• CPC Class Codes: H01J 23/34 Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
• CPC Class Codes: H01J 25/38 the forward travelling wave being utilised

Abstract

For a traveling-wave valve arrangement with a traveling-wave valve and a linearizing circuit arrangement, it is proposed to design the linearizing circuit arrangement and the traveling-wave valve as one constructional unit and, for the thermal protection of the linearizing circuit arrangement in the simultaneous presence of a high permissible temperature of the valve housing, to maintain the circuit arrangement by means of an active cooling element at a nondamaging temperature lower than the one of the wall of the valve or of a common wall. The cooling element is preferably a Peltier element.

Claims

1. A traveling-wave valve arrangement comprising a traveling-wave valve and a linearizing circuit arrangement for compensating a phase response of said traveling-wave valve, wherein said linearizing circuit arrangement and said traveling-wave valve comprise one constructional unit and said linearizing circuit arrangement is maintained at a lower temperature than a wall of said traveling-wave valve by an active cooling element.

2. The arrangement according to claim 1, wherein said linearizing circuit arrangement is disposed in an electromagnetically screened housing, wherein said electromagnetically screened housing has an outer surface and an interior.

3. The arrangement according to claim 2, wherein said outer surface of said electromagnetically screened housing is cooled by said active cooling element.

4. The arrangement according to claim 2, wherein said active cooling element is disposed within the interior of said electromagnetically screened housing.

5. The arrangement according to claim 1, wherein said linearizing circuit arrangement is disposed proximate to a radiation-generating system of said traveling-wave valve.

6. The arrangement according to claim 1, wherein said active cooling element dissipates heat emitted by said linearizing circuit arrangement into said wall of said traveling-wave valve, or into a common wall of said traveling-wave valve and said linearizer when said linearizer and said traveling-wave valve are arranged within a common housing.

7. The arrangement according to claim 1, wherein the cooling capacity of said active cooling element can be controlled.

8. The arrangement according to claim 1, wherein the temperature of said linearizing circuit arrangement is maintained below 60°

C. by said active cooling element.

9. The arrangement according to claim 1, wherein said active cooling element is a Peltier element.